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LT1206CY Datasheet(PDF) 11 Page - Linear Technology |
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LT1206CY Datasheet(HTML) 11 Page - Linear Technology |
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11 / 16 page  11 LT1206 Figure 5c. Large-Signal Response, AV = 2 When the LT1206 is used to drive capacitive loads, the available output current can limit the overall slew rate. In the fastest configuration, the LT1206 is capable of a slew rate of over 1V/ns. The current required to slew a capacitor at this rate is 1mA per picofarad of capacitance, so 10,000pF would require 10A! The photo (Figure 6) shows the large signal behavior with CL = 10,000pF. The slew rate is about 60V/ µs,determinedbythecurrentlimitof600mA. LT1206 • F06 Figure 6. Large-Signal Response, CL = 10,000pF VS = ±15V RF = RG = 3k RL = ∞ Differential Input Signal Swing The differential input swing is limited to about ±6V by an ESD protection device connected between the inputs. In normal operation, the differential voltage between the input pins is small, so this clamp has no effect; however, in the shutdown mode the differential swing can be the same as the input swing. The clamp voltage will then set the maximum allowable input voltage. To allow for some margin, it is recommended that the input signal be less than ±5V when the device is shut down. Capacitance on the Inverting Input Current feedback amplifiers require resistive feedback from the output to the inverting input for stable operation. Take care to minimize the stray capacitance between the output and the inverting input. Capacitance on the invert- ing input to ground will cause peaking in the frequency response (and overshoot in the transient response), but it does not degrade the stability of the amplifier. Power Supplies The LT1206 will operate from single or split supplies from ±5V (10V total) to ±15V (30V total). It is not necessary to use equal value split supplies, however the offset voltage and inverting input bias current will change. The offset voltage changes about 500 µV per volt of supply mis- match. The inverting bias current can change as much as 5 µA per volt of supply mismatch, though typically the change is less than 0.5 µA per volt. Thermal Considerations The LT1206 contains a thermal shutdown feature which protects against excessive internal (junction) tempera- ture. If the junction temperature of the device exceeds the protection threshold, the device will begin cycling be- tween normal operation and an off state. The cycling is not harmful to the part. The thermal cycling occurs at a slow rate, typically 10ms to several seconds, which depends on the power dissipation and the thermal time constants of the package and heat sinking. Raising the ambient tem- perature until the device begins thermal shutdown gives a good indication of how much margin there is in the thermal design. For surface mount devices heat sinking is accomplished by using the heat spreading capabilities of the PC board and its copper traces. Experiments have shown that the heat spreading copper layer does not need to be electri- cally connected to the tab of the device. The PCB material can be very effective at transmitting heat between the pad area attached to the tab of the device, and a ground or S APPLICATI I FOR ATIO LT1206 • F04c RF = 750Ω RL = 50Ω |
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