11

LT1117/LT1117-2.85

LT1117-3.3/LT1117-5

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

S

APPLICATI

TYPICAL

High Efficiency Regulator

LT1117 • TA18

ETHODS

SOLDERI G

The SOT-223 is manufactured with gull wing leadform for

surface mount applications. The leads and heatsink are

solder plated and allow easy soldering using non-active or

mildly active fluxes. The package is constructed with three

leads exiting one side of the package and one heatsink

exiting the other side, and the die attached to the heatsink

internally.

The recommended methods of soldering SOT-223 are:

vapor phase reflow and infrared reflow with preheat of

component to within 65

°C of the solder temperature.

Hand soldering and wave soldering are not recom-

mended since these methods can easily damage the

part with excessive thermal gradients across the pack-

age.

Care must be exercised during surface mount to minimize

large (> 30

°C per second) thermal shock to the package.

2k

OUTPUT

ADJUST

240

Ω

100

µF

+

470

Ω

1N914

4N28

–

+

1N914

1k

+

MR1122

10k

28V INPUT

1mH

10,000

µF

1M

10k

10k

LT1011

LT1117 • TA15

28V

OUTPUT

28V

LT1117

IN

ADJ

OUT