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LT1118-2.5 Datasheet(PDF) 6 Page - Linear Technology |
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LT1118-2.5 Datasheet(HTML) 6 Page - Linear Technology |
6 / 8 page 6 LT1118/LT1118-2.5 LT1118-2.85/LT1118-5 OPERATIO thermally connected to the die substrate. Table 1 shows measured thermal resistance from junction to ambient for the LT1118 connected to various sized PC board ground planes. The power dissipated in the LT1118 varies with input voltage and loading. When the regulator is sourcing current the power which must be dissipated by the pack- age is: PD = (VIN – VOUT) • ILOAD. When the regulator is sinking load current, power dissipa- tion is nearly independent of VIN and can be calculated as: PD = VOUT • ILOAD. Heat sinking to the IC package must consider the worst case power dissipation which may occur. Table 1. Measured Thermal Resistance from Junction to Ambient for the LT1118 S8 Package SOT-223 Free Air 120 °C/W 95 °C/W 1 Sq Inch Copper 55 °C/W 53 °C/W 4 Sq Inch Copper 35 °C/W 38 °C/W TYPICAL APPLICATIONS LT1118-2.85 GND IN 27 LINES 2.2 µF 5V 1 µF 110 Ω 110 Ω 1118 TA03 110 Ω 110 Ω 110 Ω TERMPWR OUT • • • • • • • • + LT1118-2.5 GND IN 1 µF 1118 TA04 5V ANALOG COMMON 2.5V VIN 5V OUT 1 µF SCSI Active Terminator Power Supply Splitter |
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