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LT3999 Datasheet(PDF) 13 Page - Linear Technology

Part No. LT3999
Description  Low Noise, 1A, 1MHz Push-Pull DC/DC Driver with Duty Cycle Control
Download  16 Pages
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Maker  LINER [Linear Technology]
Homepage  http://www.linear.com
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LT3999 Datasheet(HTML) 13 Page - Linear Technology

 
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LT3999
13
3999fa
For more information www.linear.com/LT3999
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MSOP (MSE) 0213 REV I
0.53
±0.152
(.021
±.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
1 2 3 4 5
4.90
±0.152
(.193
±.006)
0.497
±0.076
(.0196
±.003)
REF
8
9
10
10
1
7 6
3.00
±0.102
(.118
±.004)
(NOTE 3)
3.00
±0.102
(.118
±.004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
0.254
(.010)
0
° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.10
(.201)
MIN
3.20 – 3.45
(.126 – .136)
0.889
±0.127
(.035
±.005)
RECOMMENDED SOLDER PAD LAYOUT
1.68
±0.102
(.066
±.004)
1.88
±0.102
(.074
±.004)
0.50
(.0197)
BSC
0.305
± 0.038
(.0120
±.0015)
TYP
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.68
(.066)
1.88
(.074)
0.1016
±0.0508
(.004
±.002)
DETAIL “B”
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.05 REF
0.29
REF
MSE Package
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev I)


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