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LT1019-5 Datasheet(PDF) 11 Page - Linear Technology |
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LT1019-5 Datasheet(HTML) 11 Page - Linear Technology |
11 / 12 page 11 LT1019 Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. PACKAGE DESCRIPTIO Dimensions in inches (millimeters) unless otherwise noted. N8 Package 8-Lead PDIP (Narrow 0.300) (LTC DWG # 05-08-1510) S8 Package 8-Lead Plastic Small Outline (Narrow 0.150) (LTC DWG # 05-08-1610) H Package 8-Lead TO-5 Metal Can (0.200 PCD) (LTC DWG # 05-08-1320) N8 1098 0.100 (2.54) BSC 0.065 (1.651) TYP 0.045 – 0.065 (1.143 – 1.651) 0.130 ± 0.005 (3.302 ± 0.127) 0.020 (0.508) MIN 0.018 ± 0.003 (0.457 ± 0.076) 0.125 (3.175) MIN 0.009 – 0.015 (0.229 – 0.381) 0.300 – 0.325 (7.620 – 8.255) 0.325 +0.035 –0.015 +0.889 –0.381 8.255 () 12 3 4 87 6 5 0.255 ± 0.015* (6.477 ± 0.381) 0.400* (10.160) MAX *THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm) 0.016 – 0.050 (0.406 – 1.270) 0.010 – 0.020 (0.254 – 0.508) × 45° 0 °– 8° TYP 0.008 – 0.010 (0.203 – 0.254) SO8 1298 0.053 – 0.069 (1.346 – 1.752) 0.014 – 0.019 (0.355 – 0.483) TYP 0.004 – 0.010 (0.101 – 0.254) 0.050 (1.270) BSC 1 2 3 4 0.150 – 0.157** (3.810 – 3.988) 8 7 6 5 0.189 – 0.197* (4.801 – 5.004) 0.228 – 0.244 (5.791 – 6.197) DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE * ** 0.050 (1.270) MAX 0.016 – 0.021** (0.406 – 0.533) 0.010 – 0.045* (0.254 – 1.143) SEATING PLANE 0.040 (1.016) MAX 0.165 – 0.185 (4.191 – 4.699) GAUGE PLANE REFERENCE PLANE 0.500 – 0.750 (12.700 – 19.050) 0.305 – 0.335 (7.747 – 8.509) 0.335 – 0.370 (8.509 – 9.398) DIA 0.200 (5.080) TYP 0.027 – 0.045 (0.686 – 1.143) 0.028 – 0.034 (0.711 – 0.864) 0.110 – 0.160 (2.794 – 4.064) INSULATING STANDOFF 45 °TYP H8(TO-5) 0.200 PCD 1197 LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE AND 0.045" BELOW THE REFERENCE PLANE FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS 0.016 – 0.024 (0.406 – 0.610) * ** PIN 1 |
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