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UPD72850A Datasheet(PDF) 46 Page - NEC |
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UPD72850A Datasheet(HTML) 46 Page - NEC |
46 / 48 page Data Sheet S14452EJ1V0DS00 46 µµµµPD72850A 9. RECOMMENDED SOLDERING CONDITIONS The µPD72850A should be soldered and mounted under the following recommended conditions. For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Table 9-1. Surface Mounting Type Soldering Conditions µµµµPD72850AGK-9EU : 80-pin plastic TQFP (Fine pitch) (12 x 12 mm) Soldering Method Soldering Conditions Recommended Condition Symbol Infrared reflow Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher). Count: three times or less Exposure limit: 3 daysNote (after that prebake at 125°C for 10 hours) IR35-103-3 Partial heating Pin temperature: 300°C Max., Time: 3 sec. Max. (per pin row) — Note After opening the dry pach, store it at 25°C or less and 65% RH or less for the allowable storage period. |
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