LTC3125

3

3125fa

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute

Maximum Rating condition for extended periods may affect device

reliability and lifetime.

Note 2: The LTC3125 is tested under pulsed load conditions such that

from 0°C to 85°C junction temperature. Specifications over the –40°C

to 125°C operating junction temperature range are assured by design,

characterization and correlation with statistical process controls. The

(

ambient temperature consistent with these specifications is determined by

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

PROG Current Gain

(Note 3)

22.1

kΩ-A/A

Maximum Duty Cycle

l

85

92

%

Minimum Duty Cycle

l

0%

Frequency

l

1.3

1.6

1.9

MHz

SHDN Input High

1V

SHDN Input Low

0.35

V

SHDN Input Current

0.3

1

μA

specific operating conditions in conjunction with board layout, the rated

package thermal resistance and other environmental factors.

Note 3: Specification is guaranteed by design and not 100% tested in

production.

Note 4: Current measurements are made when the output is not switching.

Note 5: This IC includes overtemperature protection that is intended

to protect the device during momentary overload conditions. Junction

temperature will exceed 125°C when overtemperature protection is active.

Continuous operation above the specified maximum operating junction

temperature may result in device degradation or failure.

Note 6: Failure to solder the exposed backside of the package to the PC

board ground plane will result in a thermal resistance much higher than

60°C/W.

TYPICAL PERFORMANCE CHARACTERISTICS

Efficiency vs Load Current,

Efficiency vs Load Current,

LOAD CURRENT (A)

0.001

40

50

60

70

80

0.01

0.1

1

3125 G01

30

20

10

0

90

100

0.1

0.01

0.0001

0.001

1

LOAD CURRENT (A)

0.001

40

50

60

70

80

0.01

0.1

1

3125 G02

30

20

10

0

90

100

0.1

0.01

0.001

1