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LT1207 Datasheet(PDF) 11 Page - Linear Technology |
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LT1207 Datasheet(HTML) 11 Page - Linear Technology |
11 / 16 page 11 LT1207 Figure 5c. Large-Signal Response, AV = 2 Capacitance on the Inverting Input Current feedback amplifiers require resistive feedback from the output to the inverting input for stable operation. Take care to minimize the stray capacitance between the output and the inverting input. Capacitance on the invert- ing input to ground will cause peaking in the frequency response (and overshoot in the transient response), but it does not degrade the stability of the amplifier. Power Supplies The LT1207 will operate from single or split supplies from ±5V (10V total) to ±15V (30V total). It is not necessary to use equal value split supplies, however the offset voltage and inverting input bias current will change. The offset voltage changes about 500 µV per volt of supply mis- match. The inverting bias current can change as much as 5 µA per volt of supply mismatch, though typically the change is less than 0.5 µA per volt. Thermal Considerations Each amplifier in the LT1207 includes a separate thermal shutdown circuit which protects against excessive inter- nal (junction) temperature. If the junction temperature exceeds the protection threshold, the amplifier will begin cycling between normal operation and an off state. The cycling is not harmful to the part. The thermal cycling occurs at a slow rate, typically 10ms to several seconds, which depends on the power dissipation and the thermal time constants of the package and heat sinking. Raising the ambient temperature until the device begins thermal shutdown gives a good indication of how much margin there is in the thermal design. Heat flows away from the amplifier through the package’s copper lead frame. Heat sinking is accomplished by using the heat spreading capabilities of the PC board and its copper traces. Experiments have shown that the heat spreading copper layer does not need to be electrically connected to the tab of the device. The PCB material can be very effective at transmitting heat between the pad area attached to the tab of the device and a ground or power plane layer either inside or on the opposite side of the board. Although the actual thermal resistance of the PCB material is high, the length/area ratio of the thermal S APPLICATI I FOR ATIO LT1207 • F05c RF = 750Ω RL = 50Ω Differential Input Signal Swing The differential input swing is limited to about ±6V by an ESD protection device connected between the inputs. In normal operation, the differential voltage between the input pins is small, so this clamp has no effect; however, in the shutdown mode the differential swing can be the same as the input swing. The clamp voltage will then set the maximum allowable input voltage. To allow for some margin, it is recommended that the input signal be less than ±5V when the device is shut down. LT1207 • F06 Figure 6. Large-Signal Response, CL = 10,000pF VS = ±15V RF = RG = 3k RL = ∞ at this rate is 1mA per picofarad of capacitance, so 10,000pF would require 10A! The photo (Figure 6) shows the large-signal behavior with CL = 10,000pF. The slew rate is about 60V/ µs, determined by the current limit of 600mA. |
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