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AN1294 Datasheet(PDF) 14 Page - STMicroelectronics |
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AN1294 Datasheet(HTML) 14 Page - STMicroelectronics |
14 / 20 page Soldering method AN1294 14/20 Doc ID 7604 Rev 3 Figure 7. Recommended heat profile/reflow soldering for PSO10RF lead-free Stress caused by thermal shocks must be avoided by pre-heating the device to around 150-200 °C. The temperature must then be increased to at least 30 °C above the melting point of the selected solder paste and maintained long enough to allow a proper wetting and a homogeneous spread of the solder. However, under no circumstances should the device rating be exceeded (Tpeak = 250 °C). In case of infrared heating, black surfaces (such as the plastic body of the package) absorb more heat than light colored surfaces do (such as leads). The difference in temperature between the case and the leads should be less than 10 °C. Once soldering is completed, cooling of the device should not be forced as this will induce mechanical stress and potential failure. Moreover, as the thermal resistance of the solder joint is determined by the thickness of the applied solder, a thin layer of 2-4 mils, after reflow, is recommended. |
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