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AN626 Datasheet(PDF) 3 Page - STMicroelectronics |
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AN626 Datasheet(HTML) 3 Page - STMicroelectronics |
3 / 5 page DocID5663 Rev 6 3/5 AN626 5 For complete details of the correct product number, and ordering codes, for a specific product, please contact your nearest ST sales office or distributor. Table 6. Field E, 9th and 10th characters, package (two letters used in every case) Package code Package type BN PSDIP8 standard CS, CU WLCSP (Chip scale package) CT Thin WLCSP (Chip scale package) DW TSSOP8 MN SO8 narrow 0.150 mils MC or MF UFDFPN8 (MLP8) MH UFDFPN5 (MLP5) Table 7. Field F, 11th character, temperature range Device grade Temperature range 1 0 °C to 70 °C 3 –40 °C to +125 °C, with a certified reliability flow tailored for automotive applications 6 –40 °C to +85 °C 8 –40 °C to +105 °C Table 8. Field G, 12th, packing option Option code Option Blank Standard packing T Tape and reel packing Table 9. Field H, 13th, plating technology Code Plating technology P or G ECOPACK® (RoHS compliant) TF Back side coating (for WLCSP packages) Table 10. Field J, 14th, die process Code Plating technology G or S F6SP B or P F6DP AF8L K or T F8H |
Similar Part No. - AN626 |
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Similar Description - AN626 |
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