DocID5663 Rev 6

3/5

AN626

5

For complete details of the correct product number, and ordering codes, for a specific

product, please contact your nearest ST sales office or distributor.

Package code

Package type

BN

PSDIP8 standard

CS, CU

WLCSP (Chip scale package)

CT

Thin WLCSP (Chip scale package)

DW

TSSOP8

MN

SO8 narrow 0.150 mils

MC or MF

UFDFPN8 (MLP8)

MH

UFDFPN5 (MLP5)

Device grade

Temperature range

1

0 °C to 70 °C

3

–40 °C to +125 °C, with a certified reliability flow tailored for automotive applications

6

–40 °C to +85 °C

8

–40 °C to +105 °C

Option code

Option

Blank

Standard packing

T

Tape and reel packing

Code

Plating technology

P or G

TF

Back side coating (for WLCSP packages)

Code

Plating technology

G or S

F6SP

B or P

F6DP

AF8L

K or T

F8H