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PC1093 Datasheet(PDF) 14 Page - Renesas Technology Corp

Part No. PC1093
Description  ADJUSTABLE PRECISION SHUNT REGULATORS
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

PC1093 Datasheet(HTML) 14 Page - Renesas Technology Corp

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µPC1093
12
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Through-hole device
µPC1093J: 3-pin plastic SIP (TO-92)
Process
Conditions
Wave soldering
Solder temperature: 260
°C or below,
(only to leads)
Flow time: 10 seconds or less.
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
Surface mount devices
µPC1093G: 8-pin plastic SOP (225 mil)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 230
°C or below (Package surface temperature),
IR30-00-1
Reflow time: 30 seconds or less (at 210
°C or higher),
Maximum number of reflow processes: 1 time.
VPS
Peak temperature: 215
°C or below (Package surface temperature),
VP15-00-1
Reflow time: 40 seconds or less (at 200
°C or higher),
Maximum number of reflow processes: 1 time.
Wave soldering
Solder temperature: 260
°C or below, Flow time: 10 seconds or less,
WS60-00-1
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120
°C or below (Package surface temperature).
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.


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