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KIA78L05F Datasheet(PDF) 15 Page - KEC(Korea Electronics) |
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KIA78L05F Datasheet(HTML) 15 Page - KEC(Korea Electronics) |
15 / 16 page 2014. 2. 26 15/16 KIA78L05F~KIA78L24F Revision No : 6 PRECAUTIONS FOR USE When such a high voltage as exceeds 10V beyond the fixed output voltage(Typ. value) of is applied to its output terminal, IC may be destroyed. In this case, connect a zener diode between the output terminal and GND to prevent application of excessive voltage. In particular, in such a current boosting circuit as shown in application circuit example(2), if input voltage is suddenly applied by stages and furthermore load is light, excessive voltage may be applied transiently to the output terminal of IC. In such a case as this, it may become necessary to increase capacity of output capacitor as appropriate, use a smaller R1(a resistor for bypassing IC bias current) or gradually rise input voltage in addition to use of a zener diode as mentioned above. SOLDERING Flat Package (SOT-89 Package) Elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for components are all the more expanding in varieties. Especially, surface mounting is steadily penetrating into industrial segments as a world-wide popular technical trend. Although exposure to high temperature is inevitable during soldering we recommend limiting the soldering temperature to low levels as shown in figure for the sake of retaining inherent excellent reliability. (a) When employing solder reflow method ① Atmospheric temperature around resin surfaces must be less than 240℃, not exceeding the time length of 10 sec. ② Recommend temperature profile ③ Precautions on heating method When resin in kept exposed to high temperature for a long time, device reliability may be marred. Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising. (b) When employing halogen lamps or infrared-ray heaters When halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices cause extensive localized temperature rise. ※ Please keep a reflow solder operating when SOT-89 package’s soldering. 60 sec. Time (sec.) Within 30 sec. Within 10 sec. Fig 6 150 210 240 |
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