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UPD3719 Datasheet(PDF) 16 Page - NEC |
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UPD3719 Datasheet(HTML) 16 Page - NEC |
16 / 20 page µPD3719 16 NOTES ON THE USE OF THE PACKAGE The application of an excessive load to the package may cause the package to warp or break, or cause chips to come off internally. Particular care should be taken when mounting the package on the circuit board. When mounting the package, use a circuit board which will not subject the package to bending stress, or use a socket. For this product, the reference value for the three-point bending strengthNote is 30 kg. Avoid imposing a load, however, on the inside portion as viewed from the face on which the window (glass) is bonded to the package body (ceramic). Note Three-point bending strength test Distance between supports: 70 mm, Support R: R 2 mm, Loading rate: 0.5 mm / min. Load Load 70 mm 70 mm |
Similar Part No. - UPD3719 |
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Similar Description - UPD3719 |
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