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TQP569022 Datasheet(PDF) 14 Page - TriQuint Semiconductor

Part No. TQP569022
Description  1.7-2.2 GHz High IP3 Dual Channel Downconverter
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Maker  TRIQUINT [TriQuint Semiconductor]
Homepage  http://www.triquint.com
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TQP569022 Datasheet(HTML) 14 Page - TriQuint Semiconductor

 
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TQP569022
1.7
 – 2.2 GHz High IP3 Dual Channel Downconverter
Datasheet: Rev. E 01-06-15
- 14 of 14 -
Disclaimer: Subject to change without notice
© 2014 TriQuint
www.triquint.com
Mechanical Information
Package Marking and Dimensions
Marking: Part number
– TQP519022
Year, week, country code - YYWW CCCC
Assembly code
– AaXXXX
.10 C
2X
.10 C
2X
(1X) shape
0.10
C A B
(36X) 0.400x X 0.250y
0.10
C A B
GND/THERMAL PAD
.10 C
.08 C
SEATING PLANE
36X
6.0±0.1
6.0±0.1
1.85
1.85
5.40
36X 0.10
1.85
1.85
1.02±0.08
C
0.50
36X 0.50 Pitch
0.50
TERMINAL #1
IDENTIFIER
TERMINAL #1
IDENTIFIER
4
5
5
5.40
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Except where noted, this part outline conforms to JEDEC standard MO-270, Issue B (Variation DAE) for extra thin profile, fine
pitch, internal stacking module (ISM).
3. Dimension and tolerance formats conform to ASME Y14.4M-1994.
4. The contact pin numbering convention and pin 1 identifier conform to JESD 95-1 SPP-012.
5.
Co-planarity applies to the exposed ground/thermal pad as well as the contact pins.
PCB Mounting Pattern
36X 0.75
0.50 PITCH
3.70
3.70
0.33
36X 0.28
COMPONENT SIDE
25X
PACKAGE
OUTLINE
0.76
0.76
3
1
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We
recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
TQP519022
YYWW CCCC
AaXXXX


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