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TQP9321-PCB Datasheet(PDF) 2 Page - TriQuint Semiconductor |
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TQP9321-PCB Datasheet(HTML) 2 Page - TriQuint Semiconductor |
2 / 7 page TQP9321 High Efficiency 0.5 W Small Cell PA Datasheet: Rev. H 04-10-15 - 2 of 7 - Disclaimer: Subject to change without notice © 2015 TriQuint Semiconductor, Inc. www.triquint.com / www.qorvo.com Absolute Maximum Ratings Parameter Rating Storage Temperature −40 to 150 °C Supply Voltage (VCC) +6 V RF Input Power, CW, 50 Ω, T=25 °C +10 dBm Operation of this device outside the parameter ranges given above may cause permanent damage. Recommended Operating Conditions Parameter Min Typ Max Units VDD +5 V TAMB −40 25 +85 °C Tj for >106 hours MTTF +175 °C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications Test conditions unless otherwise noted: VCC = +5 V, V PD1 = VPD2 = +5 V, Temp. = +25 °C. Parameter Conditions Min Typ Max Units Operational Frequency Range 1800 2170 MHz Output Channel Power +27 dBm Gain 1805 – 1880 MHz 28.1 30 dB 1930 – 1990 MHz 27.1 29 dB 2110 – 2170 MHz 27.1 29 30.8 dB Gain Temperature Coefficient -0.024 dB/°C ACLR Uncorrected See note 1 -35 dBc ACLR Corrected See note 1 -50 dBc Power Added Efficiency 1805 – 1880 MHz, See note 1 29 % 1930 – 1990 MHz, See note 1 28 % 2110 – 2170 MHz, See note 1 27 % Output P3dB 1805 – 1880 MHz +33.6 +34.7 dBm 1930 – 1990 MHz +33.6 +34.7 dBm 2110 – 2170 MHz +33.6 +34.7 dBm P3dB Temperature Coefficient -0.008 dBm/°C Noise Figure 3.5 dB Quiescent Current, ICQ 90 110 136 mA Reference Current , IPD 2 mA Operational Current, ICC Pout = +27 dBm 340 mA VSWR Survivability Pout = +26 dBm Signal : WCDMA 1C, PAR = 8 dB 10:1 – Thermal Resistance, θjc Module (junction to case) 27 °C/W Notes: 1. Using LTE signal, 20 MHz/Carrier, IBW = 18.02 MHz, PAR 7.5 dB, Pout = +27 dBm. 2. Items in min/max columns in bold at guaranteed by production test at 2.14 GHz. 3. Items in min/max columns that are not a bold font are guaranteed by design characterization. |
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