TQP9108

1.7-2.17 GHz 2-stage Power Amplifier

Advanced Data Sheet: Rev E 09-18-14

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Disclaimer: Subject to change without notice

© 2014 TriQuint

www.triquint.com

PCB Mounting Pattern

Recommend PCB land-pad pattern metallization (Top View)

Recommended PCB solder mask opening (Top View)

Notes:

1. A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage

to the device can occur without the use of one.

2. G

round / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter

drill and have a final plated thru diameter of .25 mm (.010”).

3. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.