TQM8M9077

0.05 – 4 GHz Digital Variable Gain Amplifier

Package Marking and Dimensions

TOP VIEW

SIDE VIEW

1.02±0.08

0.10 C

5.00±0.10

2x

0.10 C

2x

0.10 C

5.00±0.10

PIN 1

Locator

BOTTOM VIEW

(4x) 0.250

(32x) 0.500 BSC

(1X) shape

0.10

C A B

1.900

0.20 x 45°

0.100

(4x)

1.900

0.225 (4x)

(16X) 0.275x X 0.240y

0.10

C A B

PIN 1 Location

(16X) 0.240x X 0.275y

0.10

C A B

1.900

1.900

2.2625

2.2625

2.2625

2.2625

C

B

A

Notes:

1. All dimensions are in millimeters. Angles are in degrees.

2. Dimension and tolerance formats conform to ASME Y14.4M-1994.

3. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.

PCB Mounting Pattern

COMPONENT SIDE

28X 0.75

0.50 PITCH

3.70

3.70

0.12

28X 0.28

25X

PACKAGE

OUTLINE

0.66

0.76

0.38

3

1

Notes:

1. All dimensions are in millimeters. Angles are in degrees.

1. Use 1 oz. copper minimum for top and bottom layer metal.

2. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We

recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).

3. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.

TQM8M9077

YYWW CCCC

AaXXXX

Package Marking

Product Identifier

Date Code

Assembly Code

Datasheet Rev. F 10-20-14

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Disclaimer: Subject to change without notice

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