856096

1090 MHz Filter

Data Sheet: Rev. C 14-06-16

- 3 of 6 -

Disclaimer: Subject to change without notice

© 2014 TriQuint

www.triquint.com

Evaluation Board

960708

C1

C2

3,4,7,8



2

5

6

50



1

1.8 pF

1.8 pF

50

Notes:

3-layers board - top, middle & bottom layer: 1 oz copper

Substrates: .031” thick FR4 dielectric.

Finish plating: Nickel: 3-8

 µm thick, Gold: .03-.2 µm thick

Hole plating: Copper min .0008

 µm thick

PCB Mounting Pattern

4.01

.81

.46

1.19

.81

1.19

1.70

.41

Notes:

1. All dimensions are in millimeters. Angles are in degrees.

2. This drawing specifies the mounting pattern used on the TriQuint evaluation

board for this product. Some modification may be necessary to suit end

user assembly materials and processes.

Bill of Material

Reference Des.

Value

Description

Manuf.

Part Number

C1

1.8

 pF

Ceramic chip, 0402,

± 0.25 pF

Murata

GRM1555C1H1R8GZ01

C2

1.8

 pF

Ceramic chip, 0402, ± 0.25

 pF

Murata

GRM1555C1H1R8GZ01

SMA

N/A

SMA connector

Johnson Components

142-0701-801

PCB

N/A

3-layer

Multiple

960708