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UPC8100 Datasheet(PDF) 15 Page - NEC |
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UPC8100 Datasheet(HTML) 15 Page - NEC |
15 / 16 page 15 µPC8100GR Data Sheet P10817EJ3V0DS00 NOTE ON CORRECT USE (1) Observe precautions for handling because of electrostatic sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground pins as short as possible. (4) Connect a bypass capacitor (e.g. 1 000 pF) to the VCC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering method and conditions than the recommended conditions are to be consulted with our sales representatives. µPC8100GR Soldering conditions Peak package’s surface temperature: 235 °C or below, Reflow time: 30 seconds or below (210 °C or higher), Number of reflow process: 2, Exposure limit*: None Peak package’s surface temperature: 215 °C or below, Reflow time: 40 seconds or below (200 °C or higher), Number of reflow process: 2, Exposure limit*: None Solder temperature: 260 °C or below, Flow time: 10 seconds or below Number of flow process: 1, Exposure limit*: None Terminal temperature: 300 °C or below, Flow time: 10 seconds or below, Exposure limit*: None Soldering process Infrared ray reflow VPS Wave soldering Partial heating method Symbol IR35–00-2 VP15–00-2 WS60–00-1 *: Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less. Note: Apply only a single process at once, except for “Partial heating method”. For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). |
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