15

µPC8100GR

Data Sheet P10817EJ3V0DS00

NOTE ON CORRECT USE

(1)

Observe precautions for handling because of electrostatic sensitive devices.

(2)

Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).

(3)

Keep the track length of the ground pins as short as possible.

(4)

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered in the following recommended conditions. Other soldering method and conditions than

the recommended conditions are to be consulted with our sales representatives.

µPC8100GR

Soldering conditions

Peak package’s surface temperature: 235

°C or below,

Reflow time: 30 seconds or below (210

°C or higher),

Number of reflow process: 2, Exposure limit*: None

Peak package’s surface temperature: 215

°C or below,

Reflow time: 40 seconds or below (200

°C or higher),

Number of reflow process: 2, Exposure limit*: None

Solder temperature: 260

°C or below,

Flow time: 10 seconds or below

Number of flow process: 1, Exposure limit*: None

Terminal temperature: 300

°C or below,

Flow time: 10 seconds or below,

Exposure limit*: None

Soldering

process

Infrared ray reflow

VPS

Wave soldering

Partial heating method

Symbol

IR35–00-2

VP15–00-2

WS60–00-1

*:

Exposure limit before soldering after dry-pack package is opened.

Storage conditions: 25

°C and relative humidity at 65 % or less.

Note:

Apply only a single process at once, except for “Partial heating method”.

For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR

DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).