ITF87056DQT datasheet(1/13 Pages) INTERSIL

Part #	ITF87056DQT

Description	5A, 20V, 0.045 Ohm, Dual P-Channel, 2.5V Specified Power MOSFET

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Manufacturer	INTERSIL [Intersil Corporation]

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1

File Number

4813.2

ITF87056DQT

5A, 20V, 0.045 Ohm, Dual P-Channel,

2.5V Speciﬁed Power MOSFET

Packaging

Symbol

Features

• Ultra Low On-Resistance

-rDS(ON) = 0.045Ω, VGS = −4.5V

-rDS(ON) = 0.048Ω, VGS = −4.0V

-rDS(ON) = 0.077Ω, VGS = −2.5V

• 2.5V Gate Drive Capability

• Gate to Source Protection Diode

• Simulation Models

- Temperature Compensated PSPICE™ and SABER

Electrical Models

- Spice and SABER Thermal Impedance Models

- www.intersil.com

• Peak Current vs Pulse Width Curve

• Transient Thermal Impedance Curve vs Board Mounting

Area

• Switching Time vs RGS Curves

Absolute Maximum Ratings

TA = 25

oC, Unless Otherwise Specified

TSSOP-8

4

1

2 3

5

GATE1(4)

DRAIN1(1)

SOURCE1(3)

OURCE1(2)

(8) DRAIN2

(7) SOURCE2

(6) SOURCE2

(5) GATE2

Ordering Information

PART NUMBER

PACKAGE

BRAND

ITF87056DQT

TSSOP-8

87056

NOTE: When ordering, use the entire part number. ITF87056DQT2

is available only in tape and reel.

ITF87056DQT

UNITS

Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS

-20

V

Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR

-20

V

Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS

±12

V

Drain Current

Continuous (TA = 25

oC, V

GS = -4.5V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID

Continuous (TA = 25

oC, V

GS = -4.0V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID

Continuous (TA = 100

oC, V

GS = -4.0V) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID

Continuous (TA = 100

oC, V

GS = -2.5V) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID

Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IDM

5.0

3.0

2.5

Figure 4

A

Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD

Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.0

16

W

mW/oC

Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG

-55 to 150

oC

Maximum Temperature for Soldering

Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TL

Package Body for 10s, See Techbrief TB370 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg

300

260

oC

NOTES:

1. TJ = 25

oC to 125oC.

2. 62.5oC/W measured using FR-4 board with 0.50 in2 (322.6 mm2 ) copper pad at 1 second.

3. 230oC/W measured using FR-4 board with 0.0022 in2 (1.44 mm2) copper pad at 1000 seconds.

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.

Data Sheet

March 2000

CAUTION: These devices are sensitive to electrostatic discharge. Follow proper ESD Handling Procedures.

1-888-INTERSIL or 321-724-7143

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