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UPC4742 Datasheet(PDF) 8 Page - NEC

Part No. UPC4742
Description  SINGLE SUPPLY VOLTAGE, HIGH SPEED, WIDE BAND, DUAL OPERATIONAL AMPLIFIERS
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Manufacturer  NEC [NEC]
Direct Link  http://www.nec.com/
Logo NEC - NEC

UPC4742 Datasheet(HTML) 8 Page - NEC

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µPC4742
8
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document “Semiconductor Device Mounting Technology Manual” (C10535E).
Type of Surface Mount Device
µPC4742G2: 8-pin plastic SOP (225 mil)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 230
°C or below (Package surface temperature),
IR30-00-1
Reflow time: 30 seconds or less (at 210
°C or higher),
Maximum number of reflow processes: 1 time.
Vapor Phase Soldering
Peak temperature: 215
°C or below (Package surface temperature),
VP15-00-1
Reflow time: 40 seconds or less (at 200
°C or higher),
Maximum number of reflow processes: 1 time.
Wave Soldering
Solder temperature: 260
°C or below, Flow time: 10 seconds or less,
WS60-00-1
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120
°C or below (Package surface temperature).
Partial heating method
Pin temperature: 300
°C or below,
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or
the device will be damaged by heat stress.
Type of Through-hole Device
µPC4742C: 8-pin plastic DIP (300 mil)
Process
Conditions
Wave soldering
Solder temperature: 260
°C or below,
(only to leads)
Flow time: 10 seconds or less.
Partial heating method
Pin temperature: 300
°C or below,
Heat time: 3 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.


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