16

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

ISL6532C

Quad Flat No-Lead Plastic Package (QFN)

Micro Lead Frame Plastic Package (MLFP)

L28.6x6

28 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE

(COMPLIANT TO JEDEC MO-220VJJC ISSUE C)

SYMBOL

MILLIMETERS

NOTES

MIN

NOMINAL

MAX

A

0.80

0.90

1.00

-

A1

-

-

0.05

-

A2

-

-

1.00

9

A3

0.20 REF

9

b

0.23

0.28

0.35

5, 8

D

6.00 BSC

-

D1

5.75 BSC

9

D2

3.95

4.10

4.25

7, 8

E

6.00 BSC

-

E1

5.75 BSC

9

E2

3.95

4.10

4.25

7, 8

e

0.65 BSC

-

k0.25

-

-

-

L

0.35

0.60

0.75

8

L1

-

-

0.15

10

N28

2

Nd

7

3

Ne

7

3

P-

-

0.60

9

θ

--

12

9

Rev. 1 10/02

NOTES:

1. Dimensioning and tolerancing conform to ASME Y14.5-1994.

2. N is the number of terminals.

3. Nd and Ne refer to the number of terminals on each D and E.

4. All dimensions are in millimeters. Angles are in degrees.

5. Dimension b applies to the metallized terminal and is measured

between 0.15mm and 0.30mm from the terminal tip.

6. The configuration of the pin #1 identifier is optional, but must be

located within the zone indicated. The pin #1 identifier may be

either a mold or mark feature.

7. Dimensions D2 and E2 are for the exposed pads which provide

improved electrical and thermal performance.

8. Nominal dimensions are provided to assist with PCB Land Pattern

Design efforts, see Intersil Technical Brief TB389.

9. Features and dimensions A2, A3, D1, E1, P &

θ are present when

Anvil singulation method is used and not present for saw

singulation.

10. Depending on the method of lead termination at the edge of the

package, a maximum 0.15mm pull back (L1) maybe present. L

minus L1 to be equal to or greater than 0.3mm.