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RJP65S06DWT Datasheet(PDF) 3 Page - Renesas Technology Corp |
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RJP65S06DWT Datasheet(HTML) 3 Page - Renesas Technology Corp |
3 / 4 page RJP65S06DWT / RJP65S06DWA R07DS0823EJ0300 Rev.3.00 Page 3 of 3 Oct 20, 2014 Die Dimension Unit: mm Illustration Part of white Part of dotted line Part of gray Note 1. Note 2. The back of the chip is processed with Au evaporation. Note 3. Recognition, target and any other patterns which are not related to Diode operation, may be changed without notice. Definition Al pattern Bonding area Final passivation 7.8 6.46 1.31 5.09 Emitter bonding pad (3) Emitter bonding pad (2) Emitter bonding pad (1) Gate bonding pad Ordering Information Orderable Part Number RJP65S06DWA-80#W0 RJP65S06DWT-80#X0 |
Similar Part No. - RJP65S06DWT_15 |
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Similar Description - RJP65S06DWT_15 |
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