R08DS0108EJ0300 Rev.3.00

Page 9 of 12

Apr 09, 2013

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering

• Peak reflow temperature

260

°C or below (package surface temperature)

• Time of peak reflow temperature

10 seconds or less

• Time of temperature higher than 220

°C

60 seconds or less

• Time to preheat temperature from 120 to 180

°C

120

±30 s

• Number of reflows

Three or less

•

Flux

Rosin flux containing small amount of chlorine (The flux with a maximum

chlorine content of 0.2 Wt% or less is recommended.)

120±30 s

(preheating)

220˚C

180˚C

Time (s)

Recommended Temperature Profile of Infrared Reflow

(heating)

to 10 s

to 60 s

260˚C MAX.

120˚C

(2) Wave soldering

• Temperature

260

°C or below (molten solder temperature)

• Time

10 seconds or less

• Preheating conditions

120

°C or below (package surface temperature)

• Number of times

One (Allowed to be dipped in solder including plastic mold portion.)

•

Flux

Rosin flux containing small amount of chlorine (The flux with a maximum

chlorine content of 0.2 Wt% or less is recommended.)

(3) Soldering by Soldering Iron

• Peak Temperature (lead part temperature) 350

°C or below

• Time (each pin)

3 seconds or less

•

Flux

Rosin flux containing small amount of chlorine (The flux with a maximum

chlorine content of 0.2 Wt% or less is recommended.)

(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead

(4) Cautions

• Fluxes

Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

2. Cautions Regarding Noise

Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output

transistor may enter the on state, even if the voltage is within the absolute maximum ratings.

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