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ADL5500 Datasheet(PDF) 19 Page - Analog Devices |
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ADL5500 Datasheet(HTML) 19 Page - Analog Devices |
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19 / 24 page  ADL5500 Rev. A | Page 19 of 24 The high accuracy range center varies over frequency. At 900 MHz, the region is centered at approximately 3 dBm. At higher frequencies, the high accuracy range is centered at higher input powers (see Figure 16 to Figure 21). DRIFT OVER A REDUCED TEMPERATURE RANGE Figure 44 shows the error over temperature for a 1.9 GHz input signal. Error due to drift over temperature consistently remains within ±0.25 dB and only begins to exceed this limit when the ambient temperature goes above +50°C and below −10°C. For all frequencies using a reduced temperature range, higher measurement accuracy is achievable. 1.00 –1.00 –20 15 INPUT (dBm) 0.75 0.50 0.25 0 –0.25 –0.50 –0.75 –15 –10 –5 0 5 10 +85°C +70°C +50°C +30°C +25°C +15°C 0°C –10°C –25°C –40°C Figure 44. Typical Drift at 1.9 GHz for Various Temperatures OPERATION ABOVE 4.0 GHz The ADL5500 works at frequencies above 4.0 GHz, but exhibits slightly higher output voltage temperature drift. Figure 45 and Figure 46 show the error distributions of six devices at 5.0 GHz and 6.0 GHz over temperature. Although the temperature drift is larger than at lower frequencies, the error distributions at each temperature remain tight throughout the central linear region. Due to the repeatability of the drift from part-to-part, compensation can be applied to reduce the effects of temperature drift. 3 –3 –25 15 INPUT (dBm) 2 1 0 –1 –2 –20 –15 –10 –5 0 5 10 Figure 45. Temperature Drift Distributions for Six Devices at −40°C, +25°C, and +85°C After Ambient Normalization, Frequency 5.0 GHz, Supply 5.0 V 3 –3 –25 15 INPUT (dBm) 2 1 0 –1 –2 –20 –15 –10 –50 510 Figure 46. Temperature Drift Distributions for Six Devices at −40°C, +25°C, and +85°C After Ambient Normalization, Frequency 6.0 GHz, Supply 5.0 V DEVICE HANDLING The wafer-level chip scale package consists of solder bumps connected to the active side of the die. The part is lead-free with 95.5% tin, 4.0% silver, and 0.5% copper solder bump composition. The WLCSP can be mounted on printed circuit boards using standard surface-mount assembly techniques; however, caution should be taken to avoid damaging the die. See the AN-617 Application Note for additional information. WLCSP devices are bumped die; therefore, the exposed die can be sensitive to light, which can influence specified limits. Lighting in excess of 600 LUX can degrade performance. |
Similar Part No. - ADL5500_15 |
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Similar Description - ADL5500_15 |
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