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5962R9571401QXC Datasheet(PDF) 3 Page - Intersil Corporation |
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5962R9571401QXC Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 6 page 3 Specifications HS-82C08RH Absolute Maximum Ratings Reliability Information Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V Input, Output or I/O Voltage . . . . . . . . . . . . GND-0.3V to VDD+0.3V Storage Temperature Range . . . . . . . . . . . . . . . . . -65oC to +150oC Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . +300oC ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1 Thermal Resistance θ JA θ JC 20 Lead SBDIP Package. . . . . . . . . . . . . 71oC/W 17oC/W 20 Lead Ceramic Flatpack Package . . . . 85oC/W 25oC/W Maximum Package Power Dissipation at +125oC Ambient 20 Lead SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . 0.70W 20 Lead Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . 0.59W If device power exceeds package dissipation capability, provide heat sinking or derate linearly at the following rate: 20 Lead SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . .14.1mW/C 20 Lead Ceramic Flatpack Package . . . . . . . . . . . . . . . 11.8mW/C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Operating Conditions Operating Voltage Range . . . . . . . . . . . . . . . . . . . +4.75V to +5.25V Operating Temperature Range . . . . . . . . . . . . . . . . -55oC to +125oC Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +1V Input High Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . VDD -1V to VDD TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS All Devices Guaranteed at Worst Case Limits and Conditions. PARAMETER SYMBOL CONDITIONS GROUP A SUBGROUPS TEMPERATURE LIMITS UNITS MIN MAX Input Leakage Current IIL VDD = 5.25V, VIN = VDD Pin Under Test = 0V 1, 2, 3 -55oC, +25oC, +125oC -1.0 - µA IIH VDD = 5.25V, VIN = 0V Pin Under Test = 5.25V 1, 2, 3 -55oC, +25oC, +125oC - 1.0 µA High Level Output Voltage VOH VDD = 4.75V, IOH = -2.0mA 1, 2, 3 -55oC, +25oC, +125oC 4.25 - V Low Level Output Voltage VOL VDD = 5.25V, IOL = 2.0mA 1, 2, 3 -55oC, +25oC, +125oC - 0.5 V Static Current SIDD VDD = 5.25V, VIN = GND 1, 2, 3 -55oC, +25oC, +125oC - 100 µA Functional Test FT VDD = 4.75V to 5.25V VIH = VDD -1.0V, VIL = 1.0V 7, 8A, 8B -55oC, +25oC, +125oC -- - TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL GROUP A SUBGROUPS TEMPERATURE LIMITS UNITS MIN MAX PORT DATA/MODE SPECIFICATIONS Propagation Delay to Logical “1” from Port A, B to Port B, A TPDLH 9, 10, 11 -55oC, +25oC, +125oC - 65 ns Propagation Delay to Logical “0” from Port A, B to Port B, A TPDHL 9, 10, 11 -55oC, +25oC, +125oC - 80 ns Propagation Delay from High-Impedance to Logical “1” from T/R to Port TPRTH 9, 10, 11 -55oC, +25oC, +125oC - 75 ns Propagation Delay from High-Impedance to Logical “0” from T/R to Port TPRTL 9, 10, 11 -55oC, +25oC, +125oC - 130 ns Propagation Delay from High-Impedance to Logical “1” from OE to Port TPZH 9, 10, 11 -55oC, +25oC, +125oC - 70 ns Propagation Delay from High-Impedance to Logical “0” from OE to Port TPZL 9, 10, 11 -55oC, +25oC, +125oC - 130 ns Spec Number 518057 |
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