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HIP6301 Datasheet(PDF) 14 Page - Intersil Corporation |
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HIP6301 Datasheet(HTML) 14 Page - Intersil Corporation |
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14 / 16 page  14 The wiring traces from the driver IC to the MOSFET gate and source should be sized to carry at least one ampere of current. Component Selection Guidelines Output Capacitor Selection The output capacitor is selected to meet both the dynamic load requirements and the voltage ripple requirements. The load transient for the microprocessor CORE is characterized by high slew rate (di/dt) current demands. In general, multiple high quality capacitors of different size and dielectric are paralleled to meet the design constraints. Modern microprocessors produce severe transient load rates. High frequency capacitors supply the initially transient current and slow the load rate-of-change seen by the bulk capacitors. The bulk filter capacitor values are generally determined by the ESR (effective series resistance) and voltage rating requirements rather than actual capacitance requirements. High frequency decoupling capacitors should be placed as close to the power pins of the load as physically possible. Be careful not to add inductance in the circuit board wiring that could cancel the usefulness of these low inductance components. Consult with the manufacturer of the load on specific decoupling requirements. Use only specialized low-ESR capacitors intended for switching-regulator applications for the bulk capacitors. The bulk capacitor’s ESR determines the output ripple voltage and the initial voltage drop following a high slew-rate transient’s edge. In most cases, multiple capacitors of small case size perform better than a single large case capacitor. Bulk capacitor choices include aluminum electrolytic, OS- Con, Tantalum and even ceramic dielectrics. An aluminum electrolytic capacitor’s ESR value is related to the case size with lower ESR available in larger case sizes. However, the equivalent series inductance (ESL) of these capacitors increases with case size and can reduce the usefulness of the capacitor to high slew-rate transient loading. Unfortunately, ESL is not a specified parameter. Consult the capacitor manufacturer and measure the capacitor’s impedance with frequency to select a suitable component. Output Inductor Selection One of the parameters limiting the converter’s response to a load transient is the time required to change the inductor current. Small inductors in a multi-phase converter reduces the response time without significant increases in total ripple current. The output inductor of each power channel controls the ripple current. The control IC is stable for channel ripple current (peak-to-peak) up to twice the average current. A single channel’s ripple current is approximately: The current from multiple channels tend to cancel each other and reduce the total ripple current. Figure 12 gives the total ripple current as a function of duty cycle, normalized to the parameter at zero duty cycle. To determine the total ripple current from the number of channels and the duty cycle, multiply the y-axis value by . Small values of output inductance can cause excessive power dissipation. The HIP6303 is designed for stable operation for ripple currents up to twice the load current. However, for this condition, the RMS current is 115% above the value shown in the following MOSFET Selection and Considerations section. With all else fixed, decreasing the ∆I V IN V OUT – F SW L × -------------------------------- V OUT V IN ---------------- × = VCORE +12V VIA CONNECTION TO GROUND PLANE ISLAND ON POWER PLANE LAYER ISLAND ON CIRCUIT PLANE LAYER LO1 COUT CIN +5VIN KEY PHASE VCC USE INDIVIDUAL METAL RUNS COMP HIP6301 PWM RT RIN RFB CBP FB VSEN ISEN RSEN HIP6601 CBOOT CBP CT VCC FS/DIS PVCC LOCATE NEXT TO IC PIN LOCATE NEXT TO FB PIN LOCATE NEXT TO IC PIN(S) ISOLATE OUTPUT STAGES FOR EACH CHANNEL TO HELP LOCATE NEAR TRANSISTOR FIGURE 11. PRINTED CIRCUIT BOARD POWER PLANES AND ISLANDS Vo () LxF SW () ⁄ Vo () LxF SW () ⁄ HIP6301 HIP6301 |
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