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HIP0060 Datasheet(PDF) 2 Page - Intersil Corporation

Part No. HIP0060
Description  1.5A, 50V Quad Low Side Power Driver with Serial Bus Control and Fault Protection
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Maker  INTERSIL [Intersil Corporation]
Homepage  http://www.intersil.com/cda/home
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HIP0060 Datasheet(HTML) 2 Page - Intersil Corporation

   
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2
Absolute Maximum Ratings
Thermal Information
Max Output Voltage, VOUT (Note 2) . . . . . . . . . . . . . . . . . . . . . VOC
Max Output Load Current, ILOAD (Per Output, Note 3) . . . . . . . . ICL
Logic Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Logic Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . -0.3V to +7V
Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . -40oC to 125oC
Junction Temperature Range . . . . . . . . . . . . . . . . -40oC to 150oC
Thermal Resistance (Typical, Notes 1, 4)
θJA (oC/W)
SOIC - PC Board Mount, Min. Copper . . . . . . . . . .
60
SOIC - PC Board Mount, 2 sq. in. Copper . . . . . . . .
35
Maximum Storage Temperature Range -55oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1.
θJA is measured with the component mounted on an evaluation PC board in free air.
2. The MOSFET Output Drain is internally clamped with a Drain-to-Gate zener diode that turns on the MOSFET; holding the Drain at the
Output Clamp voltage VOC.
3. The output drive is protected by an internal current limit. The ICL over-current limiting threshold parameter specification defines the max-
imum current. The maximum current with all outputs ON may be further limited by dissipation.
4. Device dissipation is based on thermal resistance capability of the package in a normal operating environment. The junction to ambient
thermal resistance of 60oC/W is defined here as a PC Board mounted device with minimal copper. With approximately 2 square inches
of copper area as a heat sink, it is practical to achieve 35oC/W thermal resistance. Further reduction in the thermal resistance can be
achieved with additional PC Board Copper ground area or an external heat sink structure next to the ground leads at the center of the
package.
Electrical Specifications
VDD = 4.5V to 5.5V, VSS = 0V, TA = -40
oC to 125oC; Unless Otherwise Specified
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
OUTPUTS DRIVERS (DR0 TO DR7)
Output Channel Resistance
rDSON
IOUT = 0.5A
-
-
0.8
Over-Current Limiting Threshold
ICL
1.5
-
3.5
A
Output Clamping Voltage
VOC
40
50
60
V
Output Clamping Energy
EOC
1ms Single Pulse Width, TA = 25
oC,
(Refer to Figure 3 for SOA Limits).
-85-
mJ
Output OFF Leakage Current
ILK
VOUT = 14.5V
-
-
180
µA
Open-Load Fault Threshold
ROLD
VOUT = 14.5V, Output Off
4
-
200
k
Output Rise Time
tR
RL = 30Ω, VOUT = 14.5V
1
-
12
µs
Output Fall Time
tF
RL = 30Ω, VOUT = 14.5V
1
-
12
µs
Turn-On Delay
tON
RL = 30Ω, VOUT = 14.5V
-
-
12
µs
Turn-Off Delay
tOFF
RL = 30Ω, VOUT = 14.5V
-
-
12
µs
POWER SUPPLY
Power On Reset Threshold
VDD(POR)
3.2
-
4.4
V
VDD Logic Supply Current
IDD
All Outputs ON or OFF
-
-
10
mA
LOGIC INPUTS (INx, SI, SCK, RST, CS)
High Level Input Voltage
VIH
0.7xVDD
--
V
Low Level Input Voltage
VIL
-
-
0.2xVDD
V
Input Hysteresis
VILHYS
0.8
-
-
V
High Output Voltage, SO, INT
VOL
Current Sink = 1.6mA
-
-
0.4
V
Low Output Voltage, SO
VOH
Current Source = -0.8mA
VDD-0.8
-
-
V
Input Pull-Down Current, INx
IINPD
75
-
250
µA
Reset Input Pull-Up Current, RST
IRPU
20
-
120
µA
HIP0060


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