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ADF4001BRU Datasheet(PDF) 3 Page - Analog Devices |
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ADF4001BRU Datasheet(HTML) 3 Page - Analog Devices |
3 / 17 page REV. –3– ADF4001 TIMING CHARACTERISTICS Limit at TMIN to TMAX Parameter (B Version) Unit Test Conditions/Comments t1 10 ns min DATA to CLOCK Setup Time t2 10 ns min DATA to CLOCK Hold Time t3 25 ns min CLOCK High Duration t4 25 ns min CLOCK Low Duration t5 10 ns min CLOCK to LE Setup Time t6 20 ns min LE Pulsewidth Guaranteed by design but not production tested. Specifications subject to change without notice. (AVDD = DVDD = 3 V 10%, 5 V 10%; AVDD ≤ VP ≤ 6.0 V ; AGND = DGND = CPGND= 0 V; RSET = 4.7 k ; TA = TMIN to TMAX, unless otherwise noted; dBm referred to 50 .) t1 t2 t3 t4 t6 t5 DB20 (MSB) DB19 DB2 DB1 (CONTROL BIT C2) CLOCK DATA LE LE DB0 (LSB) (CONTROL BIT C1) Figure 1. Timing Diagram ABSOLUTE MAXIMUM RATINGS 1, 2 (T A = 25 °C, unless otherwise noted.) AVDD to GND 3 . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to +0.3 V VP to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V VP to AVDD . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V Digital I/O Voltage to GND . . . . . . . . . –0.3 V to VDD + 0.3 V Analog I/O Voltage to GND . . . . . . . . . . –0.3 V to VP + 0.3 V REFIN, RFINA, RFINB to GND . . . . . . . –0.3 V to VDD + 0.3 V RFINA to RFINB . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± mV Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Maximum Junction Temperature . . . . . . . . . . . . . . . . . . 150 °C TSSOP θJA Thermal Impedance . . . . . . . . . . . . . . 150.4°C/W LFCSP θJA Thermal Impedance (Paddle Soldered) . . 122°C/W LFCSP θ JA Thermal Impedance (Paddle Not Soldered) 216 °C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2This device is a high performance RF integrated circuit with an ESD rating of <2 k Ω and it is ESD sensitive. Proper precautions should be taken for handling and assembly. 3GND = AGND = DGND = 0 V. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADF4001 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE B 600 |
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