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HI-518 Datasheet(PDF) 3 Page - Intersil Corporation |
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HI-518 Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 8 page 3 Absolute Maximum Ratings Thermal Information V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33V Analog (VIN, VOUT) . . . . . . . . . . . . . . . . . . . . . . (V-) -2V to (V+) +2V Digital Input Voltage: TTL Levels Selected (VDD/LLS Pin = GND or Open) VA0-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -6V to +6V VA2/SDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (V-) -2V to (V+) +2V CMOS Levels Selected (VDD/LLS Pin = VDD) VA0-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2V to (V+) +2V Operating Conditions Temperature Ranges HI-518-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC HI-518-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 75oC Thermal Resistance (Typical, Note 2) . . . .θJA (oC/W) θJC (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . 90 N/A CERDIP Package . . . . . . . . . . . . . . . . . 70 18 Maximum Junction Temperature Ceramic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .175oC Plastic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 2. θJA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications Supplies = +15V, -15V; VAH (Logic Level High) = 2.4V, VAL (Logic Level Low) = 0.8V; VDD/LLS = GND (Note 3), Unless Otherwise Specified PARAMETER TEST CONDITIONS TEMP (oC) -8 -5 UNITS MIN TYP MAX MIN TYP MAX DYNAMIC CHARACTERISTICS Access Time, tA 25 - 130 175 - 130 175 ns Full - - 225 - - 225 ns Break-Before-Make Delay, tOPEN 25 10 20 - 10 20 - ns Enable Delay (ON), tON(EN) 25 - 120 175 120 175 ns Enable Delay (OFF), tOFF(EN) 25 - 140 175 140 175 ns Settling Time To 0.1% 25 - 250 - - 250 - ns To 0.01% 25 - 800 - - 800 - ns Charge Injection Error Note 6 25 - - 25 - - 25 mV Off Isolation Note 7 25 45 - - 45 - - dB Channel Input Capacitance, CS(OFF) 25 - - 5 - - 5 pF Channel Output Capacitance, CD(OFF) 25 - - 10 - - 10 pF Digital Input Capacitance, CA 25 - - 5 - - 5 pF Input to Output Capacitance, CDS(OFF) 25 - 0.02 - - 0.02 - pF DIGITAL INPUT CHARACTERISTICS Input Low Threshold, VAL (TTL) Note 3 Full - - 0.8 - - 0.8 V Input High Threshold, VAH (TTL) Note 3 Full 2.4 - - 2.4 - - V Input Low Threshold, VAL (CMOS) Note 3 Full - - 0.3VDD - - 0.3VDD V Input High Threshold, VAH (CMOS) Note 3 Full 0.7VDD - - 0.7VDD -- V Input Leakage Current, IAH (High) Full - - 1 - - 1 µA Input Leakage Current, IAL (Low) Full - - 20 - - 20 µA ANALOG CHANNEL CHARACTERISTICS Analog Signal Range, VIN Note 4 Full -14 - +14 -15 - +15 V On Resistance, rON Note 5 25 - 480 750 - 480 750 Ω Full - - 1,000 - - 1,000 Ω Off Input Leakage Current, lS(OFF) 25 - 0.01 - - 0.01 - nA Full - - 50 - - 50 nA Off Output Leakage Current, ID(OFF) 25 - 0.015 - - 0.015 - nA Full - - 50 - - 50 nA On Channel Leakage Current, ID(ON) 25 - 0.015 - - 0.015 - nA Full - - 50 - - 50 nA POWER SUPPLY CHARACTERISTICS Power Dissipation, PD Full - - 450 - - 540 mW HI-518 |
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