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HCTS75K Datasheet(PDF) 8 Page - Intersil Corporation |
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HCTS75K Datasheet(HTML) 8 Page - Intersil Corporation |
8 / 9 page 477 HCTS75MS Die Characteristics DIE DIMENSIONS: 89 x 88 mils 2.25 x 2.24mm METALLIZATION: Type: SiAl Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 x 4 mils Metallization Mask Layout HCTS75MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCTS75 is TA14442A. D0 1 Q0 1 Q0 1 D1 1 (3) E 2 (4) VCC (5) D0 2 (6) (8) (9) (10) (11) 2 Q0 (12) GND (13) 1 E (14) 1 Q1 (2) (1) (16) Q1 2 Q1 2 Q0 2 D1 2 (7) (15) 1 Q1 Spec Number 518625 |
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