397

HCTS14MS

Die Characteristics

DIE DIMENSIONS:

87 x 88 mils

2,20 x 2.24mm

METALLIZATION:

Type: AlSi

Metal Thickness: 11k

Å

GLASSIVATION:

Thickness: 13k

Å

WORST CASE CURRENT DENSITY:

BOND PAD SIZE:

100

µm x 100µm

4 x 4 mils

Metallization Mask Layout

HCTS14MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS14 is TA14443A.

A1

VCC

A6

Y1 (2)

A2 (3)

Y2 (4)

A3 (5)

(6)

(7)

(8)

(9) A4

(10) Y5

(11) A5

(12) Y6

(1)

Y3

GND

Y4

(14)

(13)

Spec Number

518607