4-3

Thermal Information

Temperature, Humidity

Relay Driver

Ring Relay Supply Voltage . . . . . . . . . . . . . . . . . . . . . . 0V to 14V

Ring Relay Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA

Digital Inputs, Outputs (C1, C2, C3, C4, C5, SHD, GKD_LVM)

Output Current (SHD, GKD_LVM) . . . . . . . . . . . . . . . . . . . . . 5mA

ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500V

Gate Count. . . . . . . . . . . . . . . . . . . . . . . .543 Transistors, 51 Diodes

Tipx or Ringx Current . . . . . . . . . . . . . . . . . . . . -100mA to 100mA

Thermal Resistance (Typical, Note 1)

28 Lead PLCC Package . . . . . . . . . . . . . . . . . . . . . .

28 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . .

32 Lead PLCC Package . . . . . . . . . . . . . . . . . . . . . .

28 Lead PLCC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5W

28 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2.0W

32 Lead PLCC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.4W

(PLCC, SOIC - Lead Tips Only)

Tip and Ring Terminals

Tipx or Ringx, Current, Pulse < 10

Tipx or Ringx, Current, Pulse < 1

20A

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

1.

Typical Operating Conditions

These represent the conditions under which the device was developed and are suggested as guidelines.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Ambient Temperature

HC55120, HC55150/1

0

-

70

HC55121, HC55130/1, HC55140/1,

HC55142/3

-40

-

85

-58

-

-8

V

-0

V

4.75

-

5.25

V

HC55120, HC55121, HC55130, HC55131, HC55140, HC55141, HC55142, HC55143, HC55150, HC55151