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HC55150 Datasheet(PDF) 3 Page - Intersil Corporation |
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HC55150 Datasheet(HTML) 3 Page - Intersil Corporation |
3 / 35 page 4-3 Absolute Maximum Ratings TA =25oC Thermal Information Temperature, Humidity Storage Temperature Range . . . . . . . . . . . . . . . . -65oC to 150oC Operating Temperature Range . . . . . . . . . . . . . . . -40oC to 110oC Operating Junction Temperature Range. . . . . . . . -40oC to 150oC Power Supply (-40oC ≤ TA ≤ 85oC) Supply Voltage VCC to GND . . . . . . . . . . . . . . . . . . . . -0.4V to 7V Supply Voltage VBL to GND . . . . . . . . . . . . . . . . . . . .-VBH to 0.4V Supply Voltage VBH to GND, Continuous. . . . . . . . . . -75V to 0.4V Supply Voltage VBH to GND, 10ms . . . . . . . . . . . . . . -80V to 0.4V Relay Driver Ring Relay Supply Voltage . . . . . . . . . . . . . . . . . . . . . . 0V to 14V Ring Relay Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA Digital Inputs, Outputs (C1, C2, C3, C4, C5, SHD, GKD_LVM) Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to VCC Output Voltage (SHD, GKD_LVM Not Active). . . . . . -0.4V to VCC Output Current (SHD, GKD_LVM) . . . . . . . . . . . . . . . . . . . . . 5mA ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500V Gate Count. . . . . . . . . . . . . . . . . . . . . . . .543 Transistors, 51 Diodes Tipx and Ringx Terminals (-40oC ≤ TA ≤ 85oC) Tipx or Ringx Current . . . . . . . . . . . . . . . . . . . . -100mA to 100mA Thermal Resistance (Typical, Note 1) θJA 28 Lead PLCC Package . . . . . . . . . . . . . . . . . . . . . . 52oC/W 28 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . . 45oC/W 32 Lead PLCC Package . . . . . . . . . . . . . . . . . . . . . . 66.2oC/W Continuous Power Dissipation at 85oC 28 Lead PLCC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5W 28 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2.0W 32 Lead PLCC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.4W Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . . . . . 300oC (PLCC, SOIC - Lead Tips Only) Derate above 70oC Tip and Ring Terminals Tipx or Ringx, Current, Pulse < 10ms, TREP > 10s . . . . . . . . . .2A Tipx or Ringx, Current, Pulse < 1ms, TREP > 10s . . . . . . . . . . .5A Tipx or Ringx, Current, Pulse < 10 µs, TREP > 10s . . . . . . . . .15A Tipx or Ringx, Current, Pulse < 1 µs, TREP > 10s . . . . . . . . . .20A Tipx or Ringx, Pulse < 250ns, TREP > 10s 20A CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on an evaluation PC board in free air. Typical Operating Conditions These represent the conditions under which the device was developed and are suggested as guidelines. PARAMETER CONDITIONS MIN TYP MAX UNITS Ambient Temperature HC55120, HC55150/1 0 - 70 oC HC55121, HC55130/1, HC55140/1, HC55142/3 -40 - 85 oC VBH with Respect to GND -58 - -8 V VBL with Respect to GND VBH -0 V VCC with Respect to GND 4.75 - 5.25 V HC55120, HC55121, HC55130, HC55131, HC55140, HC55141, HC55142, HC55143, HC55150, HC55151 |
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Similar Description - HC55150 |
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