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AD8153 Datasheet(PDF) 22 Page - Analog Devices

Part No. AD8153
Description  Single Buffered Mux/Demux Switch
Download  24 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD8153 Datasheet(HTML) 22 Page - Analog Devices

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AD8153
Rev. 0 | Page 22 of 24
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
1
32
8
9
25
24
17
16
2.85
2.70 SQ
2.55
TOP
VIEW
COPLANARITY
0.08
3.50 REF
0.50
BSC
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.20 MIN
*EXPOSED
PAD
(BOT TOM VIEW)
PIN 1
INDICATOR
0.30
0.25
0.18
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
SEATING
PLANE
0.50
0.40
0.30
5.00
BSC SQ
4.75
BSC SQ
*THE AD8153 HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO VEE. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG.
Figure 41. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
AD8153ACPZ1
−40°C to +85°C
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-32-8
AD8153ACPZ-RL71
−40°C to +85°C
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-32-8
AD8153-EVALZ1
Evaluation Board
1 Z = RoHS Compliant Part.


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