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AD8143 Datasheet(PDF) 9 Page - Analog Devices

Part No. AD8143
Description  High Speed, Triple Differential Receiver with Comparators
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD8143 Datasheet(HTML) 9 Page - Analog Devices

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AD8143
Rev. 0 | Page 9 of 24
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
Supply Voltage
24 V
Power Dissipation
See Figure 2
Storage Temperature Range
–65°C to +125°C
Operating Temperature Range
–40°C to +85°C
Lead Temperature Range (Soldering 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is
specified for a device soldered in the circuit board with its
exposed paddle soldered to a pad on the PCB surface which is
thermally connected to a copper plane.
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
5 mm × 5 mm, 32-Lead LFCSP
45
7
°C/W
Maximum Power Dissipation
The maximum safe power dissipation in the AD8143 package is
limited by the associated rise in junction temperature (TJ) on
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the AD8143. Exceeding a junction temperature
of 150°C for an extended period can result in changes in the
silicon devices potentially causing failure.
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (VS) times the
quiescent current (IS). The power dissipated due to the load
drive depends upon the particular application. For each output,
the power due to load drive is calculated by multiplying the load
current by the associated voltage drop across the device. The
power dissipated due to all of the loads is equal to the sum of
the power dissipation due to each individual load. RMS voltages
and currents must be used in these calculations.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, more metal directly in contact with the package leads
from metal traces, through-holes, ground, and power planes
reduces the θJA. The exposed paddle on the underside of the
package must be soldered to a pad on the PCB surface which is
thermally connected to a copper plane to achieve the specified θJA.
Figure 2 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 32-lead LFCSP
(45°C/W) on a JEDEC standard 4-layer board with the underside
paddle soldered to a pad which is thermally connected to a PCB
plane. Extra thermal relief is required for operation at high
supply voltages. See the Applications section for details. θJA
values are approximations.
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
–40
–200
20
406080
AMBIENT TEMPERATURE (°C)
Figure 2. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.


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