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CDP6872H Datasheet(PDF) 7 Page - Intersil Corporation |
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CDP6872H Datasheet(HTML) 7 Page - Intersil Corporation |
7 / 15 page 7 CDP6872 Die Characteristics DIE DIMENSIONS: 68 x 64 x 14 ± 1mils METALLIZATION: Type: Si - Al Thickness: 10k Å ± 1kÅ GLASSIVATION: Type: Nitride (Si3N4) Over Silox (SiO2, 3% Phos) Silox Thickness: 7k Å ± 1kÅ Nitride Thickness: 8k Å ± 1kÅ DIE ATTACH: Material: Silver Epoxy - Plastic DIP and SOIC SUBSTRATE POTENTIAL: VSS Metallization Mask Layout CDP6872 CRYSTAL (2) CRYSTAL (3) (6) FREQ 1 (7) FREQ 2 |
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