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CD4018BMS Datasheet(PDF) 9 Page - Intersil Corporation |
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CD4018BMS Datasheet(HTML) 9 Page - Intersil Corporation |
9 / 9 page 358 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com CD4018BMS FIGURE 12. EXTERNAL CONNECTIONS FOR DIVIDE BY 10, 9, 8, 7, 6, 5, 4, 3, 2 OPERATION EXTERNAL CONNECTIONS FOR DIVIDE BY 10, 9, 8, 7, 6, 5, 4, 3, OPERATION DIVIDE BY 10 Q5 Connected Back To “Data” No External Components Required DIVIDE BY 8 Q4 Connected Back To “Data” No External Components Required DIVIDE BY 6 Q3 Connected Back To “Data” No External Components Required DIVIDE BY 4 Q2 Connected Back To “Data” No External Components Required DIVIDE BY 2 Q1 DIVIDE BY 9 Q4 Q5 1/2 CD4011B CONNECTED BACK TO “DATA” (SKIPS “ALL-I’s” STATE) DIVIDE BY 7 Q3 Q4 1/2 CD4011B CONNECTED BACK TO “DATA” (SKIPS “ALL-I’s” STATE) DIVIDE BY 5 Q2 Q3 1/2 CD4011B CONNECTED BACK TO “DATA” (SKIPS “ALL-I’s” STATE) DIVIDE BY 3 Q1 Q2 1/2 CD4011B CONNECTED BACK TO “DATA” (SKIPS “ALL-I’s” STATE) FIGURE 13. EXAMPLE OF DIVIDE BY 7 Chip Dimensions and Pad Layout D R CL Q3 Q4 J1 J2 J3 J4 J5 CL ÷ 7 Dimensions in parentheses are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch) METALLIZATION: Thickness: 11k Å − 14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6k Å, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches |
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