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CD4018BMS

FIGURE 12. EXTERNAL CONNECTIONS FOR DIVIDE BY 10, 9,

8, 7, 6, 5, 4, 3, 2 OPERATION

EXTERNAL CONNECTIONS FOR DIVIDE BY 10, 9, 8, 7, 6, 5, 4, 3,

OPERATION

DIVIDE BY 10 Q5 Connected

Back To “Data”

No External Components

Required

DIVIDE BY 8

Q4 Connected

Back To “Data”

No External Components

Required

DIVIDE BY 6

Q3 Connected

Back To “Data”

No External Components

Required

DIVIDE BY 4

Q2 Connected

Back To “Data”

No External Components

Required

DIVIDE BY 2

Q1

DIVIDE BY 9

Q4

Q5

1/2 CD4011B

CONNECTED BACK TO “DATA”

(SKIPS “ALL-I’s” STATE)

DIVIDE BY 7

Q3

Q4

1/2 CD4011B

CONNECTED BACK TO “DATA”

(SKIPS “ALL-I’s” STATE)

DIVIDE BY 5

Q2

Q3

1/2 CD4011B

CONNECTED BACK TO “DATA”

(SKIPS “ALL-I’s” STATE)

DIVIDE BY 3

Q1

Q2

1/2 CD4011B

CONNECTED BACK TO “DATA”

(SKIPS “ALL-I’s” STATE)

FIGURE 13. EXAMPLE OF DIVIDE BY 7

Chip Dimensions and Pad Layout

D

R

CL

Q3 Q4

J1 J2 J3 J4 J5

CL

Dimensions in parentheses are in millimeters

and are derived from the basic inch dimensions

METALLIZATION:

Thickness: 11k

Å

PASSIVATION:

10.4kÅ - 15.6k

BOND PADS:

0.004 inches X 0.004 inches MIN

DIE THICKNESS:

0.0198 inches - 0.0218 inches