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IRF6619 Datasheet(PDF) 3 Page - International Rectifier |
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IRF6619 Datasheet(HTML) 3 Page - International Rectifier |
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3 / 10 page  IRF6619 www.irf.com 3 Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient Surface mounted on 1 in. square Cu board, steady state. Used double sided cooling , mounting pad. Mounted on minimum footprint full size board with metalized back and with small clip heatsink. Notes: TC measured with thermocouple incontact with top (Drain) of part. Rθ is measured at TJ of approximately 90°C. Surface mounted on 1 in. square Cu board (still air). Mounted on minimum footprint full size board with metalized back and with small clip heatsink (still air) Mounted to a PCB with a thin gap filler and heat sink. (still air) Absolute Maximum Ratings Parameter Units PD @TA = 25°C Power Dissipation h W PD @TA = 70°C Power Dissipation h PD @TC = 25°C Power Dissipation k TP Peak Soldering Temperature °C TJ Operating Junction and TSTG Storage Temperature Range Thermal Resistance Parameter Typ. Max. Units RθJA Junction-to-Ambient hl ––– 45 RθJA Junction-to-Ambient il 12.5 ––– RθJA Junction-to-Ambient jl 20 ––– °C/W RθJC Junction-to-Case kl ––– 1.4 RθJ-PCB Junction-to-PCB Mounted 1.0 ––– Linear Derating Factor hà W/°C 0.017 270 -40 to + 150 Max. 89 2.8 1.8 1E-006 1E-005 0.0001 0.001 0.01 0.1 1 10 100 t1 , Rectangular Pulse Duration (sec) 0.0001 0.001 0.01 0.1 1 10 100 0.20 0.10 D = 0.50 0.02 0.01 0.05 SINGLE PULSE ( THERMAL RESPONSE ) Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthja + Tc τ J τ J τ 1 τ 1 τ 2 τ 2 τ 3 τ 3 R 1 R 1 R 2 R 2 R 3 R 3 Ci i /Ri Ci= τi/Ri τ τ C τ 4 τ 4 R 4 R 4 Ri (°C/W) τi (sec) 0.6784 0.00086 17.299 0.57756 17.566 8.94 9.4701 106 τA |
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Similar Description - IRF6619 |
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