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AD7530KN Datasheet(PDF) 8 Page - Intersil Corporation |
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AD7530KN Datasheet(HTML) 8 Page - Intersil Corporation |
8 / 9 page 10-14 Die Characteristics DIE DIMENSIONS: 101 mils x 103 mils (2565micrms x 2616micrms) METALLIZATION: Type: Pure Aluminum Thickness: 10 ±1kÅ PASSIVATION: Type: PSG/Nitride PSG: 7 ±1.4kÅ Nitride: 8 ±1.2kÅ PROCESS: CMOS Metal Gate Metallization Mask Layout AD7521, AD7531 PIN 3 GND PIN 2 IOUT2 PIN 1 IOUT1 PIN 18 RFEEDBACK PIN 17 VREF PIN 16 V+ PIN 12 PIN 4 BIT 1 (MSB) PIN 5 BIT 2 PIN 6 BIT 3 PIN 7 BIT 4 PIN 11 BIT 8 PIN 10 BIT 7 PIN 9 BIT 6 PIN 8 BIT 5 BIT 9 PIN 13 BIT 10 PIN 14 BIT 11 PIN 15 BIT 12 (LSB) AD7520, AD7530, AD7521, AD7531 |
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