AD7414_15 datasheet(14/20 Pages) AD

Part #	AD7414

Description	0.5C Accurate, 10-Bit Digital Temperature Sensors in SOT-23

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Manufacturer	AD [Analog Devices]

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AD7414/AD7415

Rev. F | Page 14 of 20

POWER VS. THROUGHPUT

The two modes of operation for the AD7414/AD7415 produce

different power vs. throughput performances. Mode 2 is the

sleep mode of the part, and it achieves the optimum power

performance.

Mode 1

In this mode, continuous conversions are performed at a rate of

approximately one every 800 ms. Figure 14 shows the times and

currents involved with this mode of operation for a 5 V supply.

At 5 V, the current consumption for the part when converting is

1.1 mA typically, and the quiescent current is 188 μA typically.

The conversion time of 25 μs plus power-up time of typically

4 μs contributes 199.3 nW to the overall power dissipation in

the following way:

(29 μs/800 ms) × (5 × 1.1 mA) = 199.3 nW

The contribution to the total power dissipated by the remaining

time is 939.96 μW.

(799.97 ms/800 ms) × (5 × 1.1 μA) = 199.3 μW

Thus the total power dissipated during each cycle is

199.3 nW + 939.96 μW = 940.16 μW

IDD

TIME

1.1mA

188

μA

800ms

29

μs

Figure 14. Mode 1 Power Dissipation

Mode 2

In this mode, the part is totally powered down. All circuitry

except the serial interface is switched off. The most power

efficient way of operating in this mode is to use the one-shot

method. Write to the configuration register and set the one-shot

bit to a 1. The part powers up in approximately 4 μs and then

performs a conversion. Once the conversion is finished, the

device powers down again until the PD bit in the configuration

register is set to 0 or the one-shot bit is set to 1. Figure 15 shows

the same timing as Figure 14 in mode 1; a one-shot is initiated

every 800 ms. If we take the voltage supply to be 5 V, we can

work out the power dissipation in the following way. The

current consumption for the part when converting is 1.1 mA

typically, and the quiescent current is 800 nA typically. The

conversion time of 25 μs plus the power-up time of typically

4 μs contributes 199.3 nW to the overall power dissipation in

the following way:

(29 μs/800 ms) × (5 V × 1.1 mA) = 199.3 nW

The contribution to the total power dissipated by the remaining

time is 3.9 μW.

(799.971 ms/800 ms) × (5 V × 800 nA) = 3.9 μW

Thus the total power dissipated during each cycle is:

199.3 nW + 3.9 μW = 940.16 μW

IDD

TIME

1.1mA

800nA

800ms

29

μs

Figure 15. Mode 2 Power Dissipation

MOUNTING THE AD7414/AD7415

The AD7414/AD7415 can be used for surface or air tempera-

ture sensing applications. If the device is cemented to a surface

with thermally conductive adhesive, the die temperature is

within about 0.1°C of the surface temperature, due to the

device’s low power consumption. Care should be taken to

insulate the back and leads of the device from the air if the

ambient air temperature is different from the surface

temperature being measured.

The ground pin provides the best thermal path to the die, so the

temperature of the die is close to that of the printed circuit

ground track. Care should be taken to ensure that this is in

good thermal contact with the surface being measured.

As with any IC, the AD7414/AD7415 and their associated

wiring and circuits must be kept free from moisture to prevent

leakage and corrosion, particularly in cold conditions where

condensation is more likely to occur. Water-resistant varnishes

and conformal coatings can be used for protection. The small

size of the AD7414/AD7415 packages allows them to be

mounted inside sealed metal probes, which provide a safe

environment for the devices.

SUPPLY DECOUPLING

The AD7414/AD7415 should at least be decoupled with a 0.1μF

ceramic capacitor between VDD and GND. This is particularly

important if the AD7414/AD7415 are mounted remote from

the power supply.

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