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BYC5DX-500 Datasheet(PDF) 4 Page - NXP Semiconductors |
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BYC5DX-500 Datasheet(HTML) 4 Page - NXP Semiconductors |
4 / 11 page BYC5DX-500 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 6 July 2011 4 of 11 NXP Semiconductors BYC5DX-500 Hyperfast power diode 5. Thermal characteristics Fig 3. Non-repetitive peak forward current as a function of pulse width; square waveform; maximum values 003aag307 tp (s) 10-5 10-2 10-3 10-4 102 103 IFSM (A) 101 tp P t Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-h) thermal resistance from junction to heatsink without heatsink compound - - 7.2 K/W with heatsink compound; see Figure 4 --5.5 K/W Rth(j-a) thermal resistance from junction to ambient free air -60 -K/W Fig 4. Transient thermal impedance from junction to heatsink as a function of pulse width 001aaf257 10−2 10−1 1 10 Zth(j-h) (K/W) 10−3 tp (s) 10−6 10 1 10−1 10−5 10−3 10−2 10−4 tp tp T P t T δ = |
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