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TE28F400CVT80 Datasheet(PDF) 11 Page - Intel Corporation

Part # TE28F400CVT80
Description  4-MBIT (256K X 16, 512K X 8)SmartVoltage BOOT BLOCK FLASH MEMORY FAMILY
Download  57 Pages
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

TE28F400CVT80 Datasheet(HTML) 11 Page - Intel Corporation

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E
4-MBIT SmartVoltage BOOT BLOCK FAMILY
11
PRELIMINARY
1.5
Pin Descriptions
Table 2. 28F400/004 Pin Descriptions
Symbol
Type
Name and Function
A0–A18
INPUT
ADDRESS INPUTS for memory addresses. Addresses are internally latched
during a write cycle. The 28F400 only has A0– A17 pins, while the 28F004B
has A0– A18.
A9
INPUT
ADDRESS INPUT: When A9 is at VHH the signature mode is accessed. During
this mode, A0 decodes between the manufacturer and device IDs. When BYTE#
is at a logic low, only the lower byte of the signatures are read. DQ15/A–1 is a
don’t care in the signature mode when BYTE# is low.
DQ0–DQ7
INPUT/
OUTPUT
DATA INPUTS/OUTPUTS: Inputs array data on the second CE# and WE# cycle
during a Program command. Inputs commands to the Command User Interface
when CE# and WE# are active. Data is internally latched during the write cycle.
Outputs array, Intelligent Identifier and Status Register data. The data pins float to
tri-state when the chip is de-selected or the outputs are disabled.
DQ8–DQ15
INPUT/
OUTPUT
DATA INPUTS/OUTPUTS: Inputs array data on the second CE# and WE# cycle
during a Program command. Data is internally latched during the write cycle.
Outputs array data. The data pins float to tri-state when the chip is de-selected or
the outputs are disabled as in the byte-wide mode (BYTE# = “0”). In the byte-wide
mode DQ15/A–1 becomes the lowest order address for data output on DQ0–DQ7.
The 28F004B does not include these DQ8–DQ15 pins.
CE#
INPUT
CHIP ENABLE: Activates the device’s control logic, input buffers, decoders and
sense amplifiers. CE# is active low. CE# high de-selects the memory device and
reduces power consumption to standby levels. If CE# and RP# are high, but not
at a CMOS high level, the standby current will increase due to current flow
through the CE# and RP# input stages.
OE#
INPUT
OUTPUT ENABLE: Enables the device’s outputs through the data buffers during
a read cycle. OE# is active low.
WE#
INPUT
WRITE ENABLE: Controls writes to the Command Register and array blocks.
WE# is active low. Addresses and data are latched on the rising edge of the WE#
pulse.
RP#
INPUT
RESET/DEEP POWER-DOWN: Uses three voltage levels (VIL, VIH, and VHH) to
control two different functions: reset/deep power-down mode and boot block
unlocking. It is backwards-compatible with the BX/BL/BV products.
When RP# is at logic low, the device is in reset/deep power-down mode,
which puts the outputs at High-Z, resets the Write State Machine, and draws
minimum current.
When RP# is at logic high, the device is in standard operation. When RP#
transitions from logic-low to logic-high, the device defaults to the read array mode.
When RP# is at VHH, the boot block is unlocked and can be programmed or
erased. This overrides any control from the WP# input.


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