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IDT7164S20TDB Datasheet(PDF) 6 Page - Integrated Device Technology |
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IDT7164S20TDB Datasheet(HTML) 6 Page - Integrated Device Technology |
6 / 9 page 6.1 6 IDT7164S/L CMOS STATIC RAM 64K (8K x 8-BIT) MILITARY AND COMMERCIAL TEMPERATURE RANGES AC ELECTRICAL CHARACTERISTICS (Continued) (VCC = 5.0V ± 10%, All Temperature Ranges) 7164S35 7164S45 (2) 7164S55 (2) 7164S70/85 (2) 7164L35 7164L45 (2) 7164L55 (2) 7164L70/85 (2) Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit Read Cycle tRC Read Cycle Time 35 — 45 — 55 — 70/85 — ns tAA Address Access Time — 35 — 45 — 55 — 70/85 ns tACS1 (3) Chip Select-1 Access Time — 35 — 45 — 55 — 70/85 ns tACS2 (3) Chip Select-2 Access Time — 40 — 45 — 55 — 70/85 ns tCLZ1,2 (4) Chip Select-1, 2 to Output in Low-Z 5 — 5 — 5 — 5 — ns tOE Output Enable to Output Valid — 18 — 25 — 30 — 35/40 ns tOLZ (4) Output Enable to Output in Low-Z 0 — 0 — 0 — 0 — ns tCHZ1,2 (4) Chip Select-1, 2 to Output in High-Z — 15 — 20 — 25 — 30/35 ns tOHZ (4) Output Disable to Output in High-Z — 15 — 20 — 25 — 30/35 ns tOH Output Hold from Address Change 5 — 5 — 5 — 5 — ns tPU (4) Chip Select to Power Up Time 0 — 0 — 0 — 0 — ns tPD (4) Chip Deselect to Power Down Time — 35 — 45 — 55 — 70/85 ns Write Cycle tWC Write Cycle Time 35 — 45 — 55 — 70/85 — ns tCW1, 2 Chip Select to End-of-Write 25 — 33 — 50 — 60/75 — ns tAW Address Valid to End-of-Write 25 — 33 — 50 — 60/75 — ns tAS Address Set-up Time 0 — 0 — 0 — 0 — ns tWP Write Pulse Width 25 — 25 — 50 — 60/75 — ns tWR1 Write Recovery Time ( CS1, WE) 0 —0 —0 — 0 — ns tWR2 Write Recovery Time (CS2) 5 —5 —5 — 5 — ns tWHZ (4) Write Enable to Output in High-Z — 14 — 18 — 25 — 30/35 ns tDW Data to Write Time Overlap 15 — 20 — 25 — 30/35 — ns tDH1 Data Hold from Write Time ( CS1, WE) 0 —0 —0 — 0 — ns tDH2 Data Hold from Write Time (CS2) 5 —5 —5 — 5 — ns tOW (4) Output Active from End-of-Write 4 — 4 — 4 — 4 — ns NOTES: 2967 tbl 11 1. 0 ° to +70°C temperature range only. 2. –55 °C to +125°C temperature range only. Also available: 100ns military devices. 3. Both chip selects must be active for the device to be selected. 4. This parameter is guaranteed by device characterization, but is not production tested. |
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