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MGA-86576 Datasheet(PDF) 4 Page - Agilent(Hewlett-Packard) |
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MGA-86576 Datasheet(HTML) 4 Page - Agilent(Hewlett-Packard) |
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6-231 MGA-86576 Typical Noise Parameters[3], TC = 25°C, Zo = 50 Ω, Vd = 5 V Γopt Frequency NFo GHz dB Mag. Ang. RN/50 Ω 1.0 2.1 0.56 27 0.43 1.5 1.6 0.54 31 0.40 2.5 1.5 0.47 40 0.36 4.0 1.6 0.38 54 0.32 6.0 1.8 0.28 77 0.28 8.0 2.1 0.22 107 0.25 [3]Reference plane taken at point where leads meet body of package. Figure 7. Layout for MGA-86576 Demonstration Amplifier. PCB dimensions are 1.18 inches wide by 1.30 inches high. recommend using the MGA-86576 MMIC on boards thicker than 0.040 inch. The effects of inductance asso- ciated with the board material are easily analyzed and very predict- able. As a minimum, the circuit simulation should consist of the data sheet S-Parameters and an additional circuit file describing the plated through holes and any additional inductance associated with lead length between the device and the start of the plated through hole. To obtain a complete analysis of the entire amplifier circuit, the effects of the input and output microstriplines and bias decoupling circuits should be incorporated into the circuit file. Device Connections Vd and RF Output (Pin 3) RF and DC connections are shown in Figure 8. DC power is provided to the MMIC through the same pin used to obtain RF output. A 50 Ω microstripline is used to connect the device to the following stage or output connector. A bias decoupling network is used to feed in Vdd MGA-86576 Applications Information Introduction The MGA-86576 is a high gain, broad band, low noise amplifier. The use of plated through holes or an equivalent minimal inductance grounding technique placed precisely under each ground lead at the device is highly recom- mended. A minimum of two plated through holes under each ground lead is preferred with four being highly suggested. A long ground path to pins 2 and 4 will add additional inductance which can cause gain peaking in the 2 to 4 GHz frequency range. This can also be accompanied by a decrease in stability. A suggested layout is shown in Figure 7. The circuit is designed for use on 0.031 inch thick FR-4/G-10 epoxy glass dielectric material. Printed circuit board thickness is also a major consideration. Thicker printed circuit boards dictate longer plated through holes which provide greater undesired inductance. The para- sitic inductance associated with a pair of plated through holes passing through 0.031 inch thick printed circuit board is approximately 0.1 nH, while the inductance of a pair of plated through holes passing through 0.062 inch thick board is about 0.2 nH. Hewlett-Packard does not 100-1000 pF C1 Vdd HIGH Z 10-100 Ω 27 pF 50 Ω 50 Ω 50 Ω 50 Ω 4 2 3 1 27 pF L1 R1 Figure 8. Demonstration Amplifier Schematic. |
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