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INA-52063 Datasheet(PDF) 5 Page - Agilent(Hewlett-Packard)

Part No. INA-52063
Description  1.5 GHz Low Noise Silicon MMIC Amplifier
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Manufacturer  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
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INA-52063 Datasheet(HTML) 5 Page - Agilent(Hewlett-Packard)

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Operating Details
The INA-52063 is a voltage biased
device that operates from a
+5 volt power supply with a
typical current drain of 30 mA.
All bias regulation circuitry is
integrated into the RFIC.
Figure 11 shows a typical imple-
mentation of the INA-52063. The
supply voltage for the INA-52063
must be applied to two terminals,
the VCC pin and the RF Output pin.
The VCC connection to the ampli-
fier is RF bypassed by placing a
capacitor to ground near the VCC
pin of the amplifier package.
The power supply connection to
the RF Output pin is achieved by
means of a RF choke (inductor).
The value of the RF choke must
be large relative to 50
Ω in order
to prevent loading of the RF
The supply voltage end of the RF
choke is bypassed to ground with
a capacitor. If the physical layout
permits, this can be the same
bypass capacitor that is used at
the VCC terminal of the amplifier.
Blocking capacitors are normally
placed in series with the RF Input
and the RF Output to isolate the
DC voltages on these pins from
circuits adjacent to the amplifier.
The values for the blocking and
bypass capacitors are selected to
provide a reactance at the lowest
frequency of operation that is
small relative to 50
RF Layout
An example layout for an
amplifier using the INA-52063 is
shown in Figure 12.
This example uses a microstrip-
line design (solid groundplane on
the back side of the circuit board).
The circuit board material is
0.031-inch thick FR-4. Plated
through holes (vias) are used to
bring the ground to the top side
of the circuit where needed.
Multiple vias are used to reduce
the inductance of the path to
Figure 13 shows an assembled
amplifier. The +5 volt supply is
fed directly into the VCC pin of
the INA-52063 and into the RF
Output pin through the RF choke
(RFC). Capacitor C3 provides RF
bypassing for both the VCC pin
and the power supply end of the
Capacitor C4 is optional and may
be used to add additional bypass-
ing for the VCC line. A well
bypassed VCC line is especially
necessary in cascades of ampli-
fier stages to prevent oscillation
that may occur as a result of RF
feedback through the power
supply lines.
For this demonstration circuit,
the value chosen for the RF
choke was 220 nH (Coilcraft
1008CS-221 or equivalent). All of
the blocking and bypass capac-
itors are 1000 pF. These values
provide excellent amplifier
performance from under 50 MHz
through 1 GHz. Larger values for
the choke and capacitors can be
used to extend the lower end of
the bandwidth. Since the gain of
the INA-52063 extends down to
DC, the frequency response of the
amplifier is limited only by the
values of the capacitors and
A convenient method for making
RF connection to the demonstra-
tion board is to use a PCB
mounting type of SMA connector
(Johanson 142-0701-881, or
equivalent). These connectors
can be slipped over the edge of
the PCB and the center conduc-
tors soldered to the input and
output lines. The ground pins of
the connectors are soldered to
the ground plane on the backside
of the board. The extra ground
pins for the top of the board are
not needed and are clipped off.
PCB Materials
Typical choices for PCB material
for low cost wireless applications
are FR-4 or G-10 with a thickness
of 0.025 or 0.031 inches. A thick-
ness of 0.062 inches is the maxi-
mum that is recommended for
use with this particular device.
The use of a thicker board mate-
rial increases the inductance of
the plated through vias used for
RF grounding and may deterior-
ate circuit performance. Adequate
grounding is needed not only to
obtain maximum amplifier
performance but also to reduce
any possibility of instability.
Figure 11. Basic Amplifier
Figure 12. RF Layout.

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