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INA-30311 Datasheet(PDF) 2 Page - Agilent(Hewlett-Packard) |
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INA-30311 Datasheet(HTML) 2 Page - Agilent(Hewlett-Packard) |
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6-141 Absolute Maximum Ratings Absolute Symbol Parameter Units Maximum[1] VCC Device Voltage, to ground V 12 Pin CW RF Input Power dBm +13 Tj Junction Temperature °C 150 TSTG Storage Temperature °C -65 to 150 INA-30311 Electrical Specifications[3], TC = 25°C, ZO = 50 Ω, VCC = 3 V Symbol Parameters and Test Conditions Units Min. Typ. Max. Gp Power Gain (|S21|2) f = 900 MHz dB 11 13 NF Noise Figure f = 900 MHz dB 3.5 P1dB Output Power at 1 dB Gain Compression f = 900 MHz dBm -11 IP3 Third Order Intercept Point f = 900 MHz dBm -2 VSWR Input VSWR f = 900 MHz 1.7 Icc Device Current mA 6.3 7.5 ι d Group Delay f = 900 MHz ps 325 INA-30311 Typical Scattering Parameters[3], TC = 25°C, ZO = 50 Ω, VCC = 3 V Freq. S11 S21 S12 S22 K GHz Mag Ang dB Mag Ang dB Mag Ang Mag Ang Factor 0.05 0.09 -1 16.12 6.40 -6 -38.1 0.012 2 0.57 -1 4.35 0.10 0.09 -2 16.11 6.39 -12 -38.2 0.012 4 0.56 -3 4.43 0.20 0.10 -6 16.12 6.40 -25 -38.4 0.012 8 0.56 -7 4.41 0.30 0.13 -16 16.14 6.41 -38 -38.9 0.011 13 0.55 -11 4.83 0.40 0.16 -29 16.07 6.36 -52 -39.4 0.011 19 0.54 -14 4.88 0.50 0.18 -42 15.90 6.24 -66 -40.1 0.010 27 0.52 -18 5.60 0.60 0.21 -59 15.56 6.00 -81 -40.7 0.009 40 0.50 -20 6.58 0.70 0.22 -75 15.04 5.65 -95 -40.7 0.009 57 0.47 -23 7.26 0.80 0.24 -92 14.34 5.21 -109 -39.6 0.011 74 0.46 -24 6.49 0.90 0.25 -107 13.44 4.70 -122 -37.6 0.013 86 0.44 -24 6.23 1.00 0.26 -122 12.53 4.23 -135 -35.5 0.017 94 0.43 -25 5.35 1.20 0.27 -144 10.50 3.35 -155 -32.3 0.024 100 0.42 -26 4.83 1.40 0.27 -162 8.50 2.66 -173 -29.6 0.033 101 0.42 -27 4.43 1.60 0.27 -177 6.69 2.16 172 -27.5 0.042 100 0.42 -28 4.31 1.80 0.27 173 5.01 1.78 159 -25.7 0.052 99 0.42 -30 4.22 2.00 0.27 163 3.58 1.51 147 -24.1 0.062 97 0.42 -32 4.17 2.20 0.27 156 2.35 1.31 136 -22.5 0.075 95 0.42 -35 3.97 2.40 0.26 150 1.21 1.15 126 -21.4 0.085 92 0.41 -37 4.04 2.50 0.26 147 0.75 1.09 122 -20.9 0.091 91 0.41 -39 3.99 Note: 3. Reference plane per Figure 9 in Applications Information section. Thermal Resistance[2]: θ j-c = 550°C/ W Notes: 1. Operation of this device above any one of these limits may cause permanent damage. 2. TC = 25°C (TC is defined to be the temperature at the package pins where contact is made to the circuit board). |
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