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HDLX-2416 Datasheet(PDF) 11 Page - Agilent(Hewlett-Packard) |
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HDLX-2416 Datasheet(HTML) 11 Page - Agilent(Hewlett-Packard) |
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11 / 12 page  11 Mechanical and Electrical Considerations The HDLX-2416 is an 18 pin DIP package that can be stacked horizontally and vertically to create arrays of any size. The HDLX-2416 is designed to operate continuously from -40°C to + 85°C for all possible input conditions. The HDLX-2416 is assembled by die attaching and wire bonding 140 LEDs and a CMOS IC to a high temperature printed circuit board. A polycarbonate lens is placed over the PC board creating an air gap environment for the LED wire bonds. Backfill epoxy environmentally seals the display package. This package construc- tion makes the display highly tolerant to temperature cycling and allows wave soldering. The inputs to the CMOS IC are protected against static discharge and input current latchup. How- ever, for best results standard CMOS handling precautions should be used. Prior to use, the HDLX-2416 should be stored in anti-static tubes or conductive material. During assembly a grounded conductive work area should be used, and assembly personnel should wear conductive wrist straps. Lab coats made of synthetic material should be avoided since they are prone to static charge build-up. Input current latchup is caused when the CMOS inputs are sub- jected either to a voltage below ground (Vin < ground) or to a voltage higher than VDD (Vin > VDD) and when a high current is forced into the input. To prevent input current latchup and ESD damage, unused inputs should be connected either to ground or to VDD. Voltages should not be applied to the inputs until VDD has been applied to the display. Transient input voltages should be eliminated. Soldering and Post Solder Cleaning Instructions for the HDLX-2416 The HDLX-2416 may be hand soldered or wave soldered with SN63 solder. When hand soldering it is recommended that an elec- tronically temperature controlled and securely grounded soldering iron be used. For best results, the iron tip temperature should be set at 315°C (600°F). For wave soldering, a rosin-based RMA flux can be used. The solder wave temperature should be set at 245°C ± 5°C (473°F ±9°F), and dwell in the wave should be set between 1 1/2 to 3 seconds for optimum soldering. The preheat temperature should not exceed 110 °C (230°F) as measured on the solder side of the PC board. For further information on solder- ing and post solder cleaning, see Application Note 1027, Soldering LED Components. Contrast Enhancement The objective of contrast enhance- ment is to provide good readabil- ity in the end user’s ambient lighting conditions. The concept is to employ both luminance and chrominance contrast techniques. These enhance readability by having the OFF-dots blend into the display background and the ON- dots vividly stand out against the same background. For additional information on contrast enhance- ment, see Application Note 1015. Figure 4 shows a circuit designed to dim the display from 98% to 2% by pulse width modulating the BL input. A logarithmic or a linear potentiometer may be used to adjust the display intensity. However, a logarithmic potenti- ometer matches the response of the human eye and therefore provides better resolution at low intensities. The circuit frequency should be designed to operate at 10 kHz or higher. Lower frequen- cies may cause the display to flicker. Extended Function Disable Extended Function Disable (bit D6 of the Control Register) disables the extended blanking and dim- ming functions in the HDLX-2416. If the Extended Function Disable is a logic 1, the internal brightness control, Master Blank, and Digit Blank Disable bits are ignored. However the BL input and Cursor control are still active. This allows downward compatibility to the HPDL-2416. Figure 4. Intensity Modulation Control Using an Astable Multivibrator (reprinted with permission from Electronics magazine, Sept. 19, 1974, VNU Business pub. Inc.) |
Similar Part No. - HDLX-2416 |
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Similar Description - HDLX-2416 |
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