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HCPL-520X Datasheet(PDF) 2 Page - Agilent(Hewlett-Packard)

Part No. HCPL-520X
Description  Hermetically Sealed, Low IF, Wide VCC, Logic Gate Optocouplers
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Maker  HP [Agilent(Hewlett-Packard)]
Homepage  http://www.home.agilent.com
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HCPL-520X Datasheet(HTML) 2 Page - Agilent(Hewlett-Packard)

 
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Selection Guide–Package Styles and Lead Configuration Options
Package
8 Pin DIP
8 Pin DIP
16 Pin Flat Pack
20 Pad LCCC
Lead Style
Through Hole
Through Hole
Unformed Leads
Surface Mount
Channels
1
2
4
2
Common Channel
None
VCC, GND
VCC, GND
None
Wiring
Agilent Part # & Options
Commercial
HCPL-5200
HCPL-5230
HCPL-6250
HCPL-6230
MIL-PRF-38534, Class H
HCPL-5201
HCPL-5231
HCPL-6251
HCPL-6231
MIL-PRF-38534, Class K
HCPL-520K
HCPL-523K
HCPL-625K
HCPL-623K
Standard Lead Finish
Gold Plate
Gold Plate
Gold Plate
Soldered Pads
Solder Dipped
Option #200
Option #200
Butt Cut/Gold Plate
Option #100
Option #100
Gull Wing/Soldered
Option #300
Option #300
Class H SMD Part #
Prescript for all below
5962-
5962-
5962-
5962-
Either Gold or Solder
8876801PX
8876901PX
8876903FX
88769022X
Gold Plate
8876801PC
8876901PC
8876903FC
Solder Dipped
8876801PA
8876901PA
88769022A
Butt Cut/Gold Plate
8876801YC
8876901YC
Butt Cut/Soldered
8876801YA
8876901YA
Gull Wing/Soldered
8876801XA
8876901XA
Class K SMD Part #
Prescript for all below
5962-
5962-
5962-
5962-
Either Gold or Solder
8876802KPX
8876904KPX
8876906KFX
8876905K2X
Gold Plate
8876802KPC
8876904KPC
8876906KFC
Solder Dipped
8876802KPA
8876904KPA
8876905K2A
Butt Cut/Gold Plate
8876802KYC
8876904KYC
Butt Cut/Soldered
8876802KYA
8876904KYA
Gull Wing/Soldered
8876802KXA
8876904KXA
which allows for direct connection
to data buses. The output is non-
inverting. The detector IC has an
internal shield that provides a
guaranteed common mode
transient immunity of up to
10,000 V/
µs. Improved power
supply rejection eliminates the
need for special power supply
bypass precautions.
Package styles for these parts are
8 pin DIP through hole (case
outline P), 16 pin DIP flat pack
(case outline F), and leadless
ceramic chip carrier (case outline
2). Devices may be purchased
with a variety of lead bend and
plating options, see Selection
Guide Table for details. Standard
Microcircuit Drawing (SMD)
parts are available for each
package and lead style.
Because the same electrical die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are identical for all parts.
Occasional exceptions exist due
to package variations and limita-
tions and are as noted. Addition-
ally, the same package assembly
processes and materials are used
in all devices. These similarities
give justification for the use of
data obtained from one part to
represent other part’s per-
formance for die related
reliability and certain limited
radiation test results.


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