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HCPL-2200 Datasheet(PDF) 8 Page - Agilent(Hewlett-Packard) |
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HCPL-2200 Datasheet(HTML) 8 Page - Agilent(Hewlett-Packard) |
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8 / 15 page  1-138 VDE 0884 Insulation Related Characteristics (HCNW22XX ONLY) Description Symbol Characteristic Units Installation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤ 600 V rms I-IV for rated mains voltage ≤ 1000 V rms I-III Climatic Classification 55/100/21 Pollution Degree (DIN VDE 0110/1.89) 2 Maximum Working Insulation Voltage VIORM 1414 V peak Input to Output Test Voltage, Method b* VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec, VPR 2652 V peak Partial Discharge < 5 pC Input to Output Test Voltage, Method a* VIORM x 1.5 = VPR, Type and sample test, VPR 2121 V peak tm = 60 sec, Partial Discharge < 5 pC Highest Allowable Overvoltage* (Transient Overvoltage, tini = 10 sec) VIOTM 8000 V peak Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure 12, Thermal Derating curve.) Case Temperature TS 150 °C Current (Input Current IF, PS = 0) IS,INPUT 400 mA Output Power PS,OUTPUT 700 mW Insulation Resistance at TS, VIO = 500 V RS ≥ 109 Ω *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section (VDE 0884), for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application. Absolute Maximum Ratings Parameter Symbol Min. Max. Units Note Storage Temperature TS -55 125 °C Operating Temperature TA -40 85 °C Average Forward Input Current IF(AVG) 10 mA 1 Peak Transient Input Current ( ≤ 1 µs Pulse Width, 300 pps) IF(TRAN) 1.0 A 1 ( ≤ 200 µs Pulse Width, HCNW22XX 40 mA < 1% Duty Cycle) Reverse Input Voltage VR 5V 1 HCNW22XX 3 Average Output Current IO 25 mA 1 Supply Voltage VCC 020 V Output Voltage VO -0.5 20 V 1 Total Package Power Dissipation PT 210 mW 2 HCPL-223X 294 Output Power Dissipation PO See Figure 7 1 Lead Solder Temperature (Through Hole Parts 260 °C for 10 sec., Only) 1.6 mm below seating plane HCNW22XX 260 °C for 10 sec., up to seating plane Solder Reflow Temperature Profile (Surface See Package Outline Drawings section Mount Parts Only) |
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